Abstract
Several micrometer thick layers of platinum or copper can be photolithographically deposited on Mylar or silica substrates by taking advantage of the photochemistry of [PtCl6]2− in alcohols. This reaction gives rise to a spatially well defined, but discontinuous deposit of platinum metal onto the illuminated areas of the substrate material. A conducting, adhesive, metallic film can be obtained by developing the photolyzed substrate in an electroless copper plating bath or a bath containing [PtCl4]2− and isopropanol, depending on the type of deposit required. Control over the rate of metallization and the spatial resolution of the deposit can be exerted by considering the detailed mechanistic chemistry associated with the metallization process.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
A. Vogler and J. Hlavatsch, Angew. Chem., Int. Ed., 22. 154, (1983).
R. E. Cameron and A. B. Bocarsly, J. Am. Chem. Soc, 107, 6116 (1985).
A. B. Bocarsly, R. E. Cameron, and Meisheng Zhou, in “Photochemistry and Photophysics of Coordination Compounds,” H. Yersin and A. Vogler, Editors, p. 177, Springer Verlag, Berlin, 1987.
R. E. Cameron and A. B. Bocarsly, Inorg. Chem., 25. 2910, (1986).
R. E. Cameron, Ph.D. Thesis, (pp 39-40), Princeton University, 1986.
F. J. Schwab, Departmental Thesis, Princeton University, 1986.
G. A. Shagisultanova, Koord. Chem., 7. 1527 (1981).
I. I. Blinov and G. A. Shagisultanova, Koord. Chern:, 8. 191 (1982).
V. P. Grivin, I. V. Khmelinski and V. F. Plyusnin, J. Photochem Photobiol. A: Chemistry, 51, 379 (1990).
J. Chatt, B. L. Shaw, J. Chem. Soc, 5075 (1962).
P. Gröser, Angew. Chem., Int. Ed., 6, 364 (1967).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1991 Springer Science+Business Media New York
About this chapter
Cite this chapter
Zhou, M., Cameron, R.E., Schwab, F.J., Bocarsly, A.B. (1991). Photolithographic Plating of Platinum and Copper on Insulating Substrates. In: Mittal, K.L. (eds) Metallized Plastics 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-0735-6_4
Download citation
DOI: https://doi.org/10.1007/978-1-4899-0735-6_4
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-0737-0
Online ISBN: 978-1-4899-0735-6
eBook Packages: Springer Book Archive