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Adherent Electroless Copper Layers on Polystyrene

  • Charles E. Baumgartner

Abstract

Molded polystyrene and polystyrene containing blends such as Noryl®resin* can be chemically modified using chlorosulfonic acid to produce a sulfonic acid derivatized surface which is capable of being electrolessly copper plated using standard catalyzation and plating procedures. Following metallization, adhesion develops across the copper/polystyrene interface via a chemical bond that forms through the sulfonic acid linkage concomitant with the loss of interfacial water. The rate at which adhesion develops after plating increases with bake temperature and, for a given temperature, increases with decreasing relative humidity. No adhesion develops in ambients with a relative humidity approaching 100%.

Keywords

Interfacial Adhesion Peel Test Chlorosulfonic Acid Electroless Copper Bake Condition 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • Charles E. Baumgartner
    • 1
  1. 1.GE Corporate Research & DevelopmentSchenectadyUSA

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