Abstract
The system investigated was Au/Cu/Ti/Polyimide. Heat treatment of these films in reducing ambient introduced a host of problems resulting in film failure. SIMS depth profiles were determined for samples annealed in hydrogen (an essential component of forming gas), at different concentrations and temperatures. It was observed that the hydrogen segregates at the diffusion barrier (Ti), and causes delamination under certain conditions. SIMS, Auger, XPS and X-ray diffraction techniques were used to characterize the interface and to locate the delamination plane in the metal/polymer system.
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© 1991 Springer Science+Business Media New York
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Sengupta, K.S., Birnbaum, H.K. (1991). Study of Titanium/Polyimide Interface in a Reducing Environment. In: Mittal, K.L. (eds) Metallized Plastics 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-0735-6_21
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DOI: https://doi.org/10.1007/978-1-4899-0735-6_21
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