Behavior of Metal — Polyimide Interfaces Under Degradative Ambients

  • K. Seshan
  • R. H. Lacombe
Chapter

Abstract

During wire bond reliability testing, samples which contained multilayer thin film metal bonding pads on polyimide were subjected to thermal cycling in deleterious ambients. Subsequently the bonds were pull tested. Wire bond pull test results showed that the region between the metal and the polyimide had degraded. This degradation is evidenced by low pull strengths and apparent interfacial failures.

Keywords

Transition Zone Transition Layer Maximum Principal Stress Wire Bond Nonnal Stress 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • K. Seshan
    • 1
  • R. H. Lacombe
    • 1
  1. 1.IBM E. Fishkill FacilityHopewell JunctionUSA

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