Behavior of Metal — Polyimide Interfaces Under Degradative Ambients

  • K. Seshan
  • R. H. Lacombe


During wire bond reliability testing, samples which contained multilayer thin film metal bonding pads on polyimide were subjected to thermal cycling in deleterious ambients. Subsequently the bonds were pull tested. Wire bond pull test results showed that the region between the metal and the polyimide had degraded. This degradation is evidenced by low pull strengths and apparent interfacial failures.


Transition Zone Transition Layer Maximum Principal Stress Wire Bond Nonnal Stress 
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Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • K. Seshan
    • 1
  • R. H. Lacombe
    • 1
  1. 1.IBM E. Fishkill FacilityHopewell JunctionUSA

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