Advertisement

Behavior of Metal — Polyimide Interfaces Under Degradative Ambients

  • K. Seshan
  • R. H. Lacombe

Abstract

During wire bond reliability testing, samples which contained multilayer thin film metal bonding pads on polyimide were subjected to thermal cycling in deleterious ambients. Subsequently the bonds were pull tested. Wire bond pull test results showed that the region between the metal and the polyimide had degraded. This degradation is evidenced by low pull strengths and apparent interfacial failures.

Keywords

Transition Zone Transition Layer Maximum Principal Stress Wire Bond Nonnal Stress 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    M. Terasawa, S. Minami and J. Rubin, Intl. J. Hybrid Microelectronics, 6, 607 (1983).Google Scholar
  2. 2.
    T. Watari and H. Murano, IEEE Trans. CHMT-8, No. 4, 462–467 (1985).Google Scholar
  3. 3.
    L. B. Rothman, J. Electrochemical Soc., 130(5), 1131 (1983).CrossRefGoogle Scholar
  4. 4.
    K. L. Mittal, Editor, “Polyimides: Synthesis, Characterization and Applications,” Vols. 1 and 2, Plenum Press, New York (1984).Google Scholar
  5. 5.
    C. A. Kovac, J. L. Jordan-Sweet, M. J. Goldberg, J. G. Clabes, A. Viehbeck and R. A. Pollak, IBM J. Res. Dev. 32(5), 603 (1988).CrossRefGoogle Scholar
  6. 6.
    F. Faupel, C. H. Yang, S. T. Chen and P. S. Ho, J. Appl. Phys., 65, 1911 (1989).CrossRefGoogle Scholar
  7. 7.
    P. S. Ho, P. D. Hahn, J. W. Bartha, G. W. Rubloff, F. K. LeGoues, B. D. Silverman, J. Vac. Sci. Technol. A3 (3), 739 (1985).Google Scholar
  8. 8.
    P. S. Ho, B. D. Silvennan, R. A. Haight, R. C. White, P. N. Sanda, A. R. Rossi, IBM J.Res. Dev., 32, 658 (1988).CrossRefGoogle Scholar
  9. 9.
    Y. H. Kim, G. F. Walker, J. Kim and J. Park, J. Adhesion Sci. Technol., 1, 331 (1987).CrossRefGoogle Scholar
  10. 10.
    K. L. Mittal, “Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings” K. L. Mittal, editor, ASTM STP 640, American Society For Testing and Materials, Philadelphia, 1978.Google Scholar
  11. 11.
    L.P. Buchwalter, J. Adhesion Sci. Technol., 1, 341 (1987).CrossRefGoogle Scholar
  12. 12.
    R. S. Horwath, R. L. Headrick, and J. W. Wilson, Proc. Intl. Ion Engineering Congress, 3, 1743–6 (1983).Google Scholar
  13. 13.
    K. W. Paik, and A. L. Ruoff, J. Adhesion Sci. Technol., 2, 245 (1988).CrossRefGoogle Scholar
  14. 14.
    A. L. Ruoff, E. J. Kramer, and C-Y Li, IBM J. Res. Dev. 32(5), 626 (1988).CrossRefGoogle Scholar
  15. 15.
    B.K. Furman, S. Purushothaman, E. Castellani, S. Renick, and D. Neugroschl, in “Metallization of Polymers,” E. Sacher, J.J. Pireaux and S. P. Kowalczyk, editors, ACS Symposium Series No. 440, p. 297(1990).Google Scholar
  16. 16.
    K. Seshan, S.N.S Reddy, S. K. Ray Proc. 37th IEEE Electronics Components Conference, 604 (1987).Google Scholar
  17. 17.
    ANSYS is the trademark of Swanson Analysis Systems, Huston, PA.Google Scholar
  18. 18.
    J. N. Färber and R. Farris, J. Appl. Polym. Sci. 34, 2093 (1987).CrossRefGoogle Scholar
  19. 19.
    G. Samsonov, Editor, “The Oxide Handbook,” 2nd Edition, Plenum Press, New York (1982).Google Scholar

Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • K. Seshan
    • 1
  • R. H. Lacombe
    • 1
  1. 1.IBM E. Fishkill FacilityHopewell JunctionUSA

Personalised recommendations