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Comparison Between the Interfacial Chemistry of Metallized Polyimides and Polyimide Films on Bulk Metal Substrates

  • M. Grunze
  • A. Killinger
  • C. Thümmler
  • C. Hahn
  • T. Strunskus

Abstract

In this short overview the pertinent differences in the chemical interaction in differently prepared polyimide/metal interfaces are summarized. Considered are the cases of metals (Cr, Cu) deposited onto cured polyimide surfaces, interfaces prepared by spin coating polyamic acid onto a bulk substrate and subsequent thermal imidization, vapor deposited polyamic acid on bulk substrates (Cu, Ag, Si, Cr) with subsequent thermal imidization, and deposition of polyamic acid in the form of mono- and multilayers by Langmuir-Blodgett (LB) techniques onto a Si (100) surface. New FTIR and XPS data are discussed for copper deposition onto polyimide.

Keywords

Copper Deposition Cuprous Oxide Polyimide Film Interfacial Chemistry Amic Acid 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • M. Grunze
    • 1
  • A. Killinger
    • 1
  • C. Thümmler
    • 1
  • C. Hahn
    • 2
  • T. Strunskus
    • 2
  1. 1.Lehrstuhl für Angewandte Physikalische Chemie am Physikalisch-Chemischen InstitutUniversität HeidelbergHeidelbergGermany
  2. 2.Laboratory for Surface Science and Technology and Department of PhysicsUniversity of MaineOronoUSA

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