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Real-Time Thickness Measurement of Metal Oxide Film Growth

  • R. T. Allemeier
  • J. W. Wagner

Abstract

The use of Dynamic Imaging Microellipsometry (DIM) for mapping and measuring oxide film thickness during growth has been demonstrated. The DIM system facilitates the analysis of oxide film characteristics by determining the polarization properties of a beam of light reflected from an oxide film/substrate system. While the principles of DIM are much the same as those for conventional ellipsometry there are significant differences. These differences, most notably, the use of a CCD video camera as a detector coupled with image processing capabilities, permit the production of spatially resolved ellipsometric “images” at high repetition rates. Using the high spatial and temporal resolution of the DIM system, a sequence of ellipsometric images have been generated showing the growth of cuprite (0Cu 2 O) on copper. This data clearly demonstrates the capability of DIM for measuring dynamic changes in oxide film thickness.

Keywords

Oxide Film High Repetition Rate Ellipsometric Measurement Oxide Film Thickness Copper Oxide Film 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    F. L. McCrackin, A Fortran Program for Analysis of Ellipsometric Measurements, NBS Technical Note 479 April 1969.Google Scholar
  2. 2.
    R. F. Conn, J. W. Wagner, and J. Kruger, Dynamic Imaging Microellipsometry: Proof Concept Test Results, J. Electrochem. Soc. v 135, n 4:1033–1034 (1988).CrossRefGoogle Scholar
  3. 3.
    Gaertner Scientific Corp., “Auto Gain Ellipsometers”, Bulletin EE, pg. 13.Google Scholar
  4. 4.
    R. M. A. Azzam and N. M. Bashara, Theory and Analysis of Measurements in Ellipsometry, in: “Ellipsometry and Polarized Light,” North-Holland, Amsterdam (1987).Google Scholar
  5. 5.
    R. F. Cohn and J. W. Wagner, Nondestructive Mapping of Surface Film Parameters with Dynamic Imaging Microellipsometry, in: “Review of Progress in Quantitative NDE,” 8A, Donald O. Thompson and Dale Chimenti eds., Plenum Press, New York (1989).Google Scholar
  6. 6.
    Harold Wieder and A. W. Czanderna, Optical Properties of Copper Oxide Films, J. App. Phys. v 37, n1:184–187 (1966).CrossRefGoogle Scholar
  7. 7.
    T. N. Rhodin Jr., Low Temperature Oxidation of Copper. II. Reaction Rate Anisoptropy, J. Am. Chem. v73, (July, 1951).Google Scholar
  8. 8.
    Jerome Kruger, The Oxide Films on Copper Single Crystal Surfaces in Water II. Rate of Growth at Room Temperature, J. Electrochem. Soc. v108, n6 (June, 1961).Google Scholar

Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • R. T. Allemeier
    • 1
  • J. W. Wagner
    • 1
  1. 1.The Johns Hopkins UniversityBaltimoreUSA

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