Real-Time Thickness Measurement of Metal Oxide Film Growth
The use of Dynamic Imaging Microellipsometry (DIM) for mapping and measuring oxide film thickness during growth has been demonstrated. The DIM system facilitates the analysis of oxide film characteristics by determining the polarization properties of a beam of light reflected from an oxide film/substrate system. While the principles of DIM are much the same as those for conventional ellipsometry there are significant differences. These differences, most notably, the use of a CCD video camera as a detector coupled with image processing capabilities, permit the production of spatially resolved ellipsometric “images” at high repetition rates. Using the high spatial and temporal resolution of the DIM system, a sequence of ellipsometric images have been generated showing the growth of cuprite (0Cu 2 O) on copper. This data clearly demonstrates the capability of DIM for measuring dynamic changes in oxide film thickness.
KeywordsOxide Film High Repetition Rate Ellipsometric Measurement Oxide Film Thickness Copper Oxide Film
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