Abstract
Determination of material properties in real time during preparation or processing is an important problem in materials research. Many technologically relevant thin film materials are fabricated in adverse environments such as plasmas or reactive gases. In these situations, an optical probe is among the few non-invasive methods of real time characterization.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
J. B. Theeten, Surf. Sci. 96, 275 (1980).
D. E. Aspnes, Proc. Soc. Photo-Opt. Instrum. Eng. 226, 188 (1981).
R. H. Muller and J. C. Farmer, Rev. Sci. Instrum. 55, 371 (1984).
Y. Cong, I. An, R. W. Collins, K. Vedam, H. S. Witham, L. J. Pilione, and R. Messier, Proc. 8th Int. Conf. on Thin Films, San Diego CA, April 2-6 1990, Thin Solid Films (in press).
D. E. Aspnes and A. A. Studna, Appl. Opt. 14, 220 (1975).
J. C. Angus, P. Koidl, and S. Domitz, in: Plasma Deposited Thin Films, edited by J. Mort and F. Jansen, (CRC, Boca Raton FL, 1986), p. 89.
D. E. Aspnes, S. M. Kelso, R. A. Logan, and R. Bhat, J. Appl. Phys. 60, 754 (1986).
D. E. Aspnes, G. P. Schwartz, G. J. Gualtieri, A. A. Studna, and B. Schwartz, J. Electrochem. Soc. 128, 590 (1981).
A. Gheorghiu and M.-L. Theye, Philos. Mag. B 44, 285 (1981).
R. W. Collins, J. Vac. Sci. Technol. A7, 1378 (1989).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1991 Springer Science+Business Media New York
About this chapter
Cite this chapter
Collins, R.W. et al. (1991). Real Time Spectroscopic Ellipsometry for Non-Invasive Characterization of Thin Film Growth and Etching. In: Ruud, C.O., Bussière, J.F., Green, R.E. (eds) Nondestructive Characterization of Materials IV. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-0670-0_5
Download citation
DOI: https://doi.org/10.1007/978-1-4899-0670-0_5
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-0672-4
Online ISBN: 978-1-4899-0670-0
eBook Packages: Springer Book Archive