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Micromechanical Analysis of the TiO2/Si Interface Using the Scanning Acoustic Microscope

  • M. H. McCord
  • J. C. Duke
  • S. B. Desu

Abstract

With the increasing use of thin film devices, a need has arisen for a better understanding of the mechanical properties of these film/substrate systems. Of particular importance, in many cases, is the adhesion between substrate and film. Several methods are commonly used to test the mechanical behavior of these interfacial systems, but for the most part, they are not quantitative, lack repeatability, and result in destruction of the sample [1]. In cases where the sample is rare or difficult to prepare, a nondestructive method would be highly desirable.

Keywords

Rayleigh Wave Single Crystal Silicon Adhesive Joint Acoustic Image Aperture Angle 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • M. H. McCord
    • 1
  • J. C. Duke
    • 1
  • S. B. Desu
    • 1
  1. 1.Virginia Polytechnic Institute and State UniversityBlacksburgUSA

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