Bus Architecture

  • Changyi Gu


All parts should go together without forcing. You must remember that the parts you are reassembling were disassembled by you. Therefore, if you can't get them together again, there must be a reason. By all means, do not use a hammer.


Device Driver Serial Link Clock Domain Serial Peripheral Interface Base Clock 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1.  1.
    LVDS Owner’s Manual (4th Edition). National Semiconductor, 2008Google Scholar
  2.  2.
    “Best Practices for the Quartus II TimeQuest Timing Analyzer.” (Chapter  7, Quartus II Handbook. Version 10.1, Vol 3)
  3.  3.
    PCI Express Base Specification 3.0, PCI-SIG, November 10, 2010Google Scholar
  4.  4.
    PCI Local Bus Specification Revision 3.0, PCI-SIG, August 12, 2002Google Scholar
  5.  5.
    Signal Integrity Simplified. Eric Bogatin, Prentice Hall Professional Technical Reference, 2004Google Scholar
  6.  6.
    Signal Integrity Issues and Printed Circuit Board Design. Douglas Brooks, Prentice Hall Professional Technical Reference, 2003Google Scholar
  7.  7.
    Datasheet of Agilent N4850A DigRF v3 Acquisition Probe, N4860A DigRF v3 Stimulus Probe, Agilent Technologies, Inc., 2007Google Scholar
  8.  8.
    Serial ATA Revision 3.0, Serial ATA International Organization, May, 2009Google Scholar
  9.  9.
    A DC-Balanced, Partitioned-Block, 8B/10B Transmission Code, A. X. Widmer and P. A. Franaszek, IBM Journal of Research and Development, Vol. 27, No.5, September, 1983Google Scholar
  10. 10.
    ±15kV ESD-Protected, 1μA, 3.0V to 5.5V, 250kbps, RS-232 Transceivers with AutoShutdown (Rev 6), Maxim Integrated Products, Inc., September, 2005Google Scholar
  11. 11.
    Tera Term Open Source Project (
  12. 12.
    UM10204, I2C-Bus Specification and User Manual Rev. 03, NXP Semiconductors, June 19, 2007Google Scholar
  13. 13.
    System Management Bus (SMBus) Specification Version 2.0, SBS Implementers Forum, August 3, 2000Google Scholar
  14. 14.
    AN-300, SPI Bus Compatibility, FM25160 16KB SPI FRAM, Ramtron International Corporation, February, 1999Google Scholar
  15. 15.
    WinDriver PCI/ISA/CardBus User’s Manual, Version 10.2.1, Jungo Ltd., 2010Google Scholar
  16. 16.
    Advanced Configuration and Power Interface Specification, Rev 4.0a, Hewlett-Packard Corp, Intel Corp, Microsoft Corp, Phoenix Tech Ltd, Toshiba Corp, April, 5, 2010Google Scholar
  17. 17.
    Universal Serial Bus Specification, Revision 2.0, Compaq, Hewlett-Packard, Intel, Lucent, Microsoft, NEC, Philips, April 27, 2000Google Scholar
  18. 18.
    Universal Serial Bus 3.0 Specification, Revision 1.0, Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, NEC Corporation, ST-NXP Wireless, Texas Instruments, November 12, 2008Google Scholar
  19. 19.
    “How to Use WinUSB to Communicate with a USB Device,” Microsoft Corporation, March 9, 2010Google Scholar
  20. 20.
    EZ-USB Technical Reference Manual, Version 1.2, Cypress Semiconductor Corporation, 2005Google Scholar
  21. 21.
    On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification, Revision 2.0 plus errata and ecn, USB Implementers Forum, Inc., June 4, 2010Google Scholar
  22. 22.
    UTMI+ Low Pin Interface (ULPI) Specification, Revision 1.1, ULPI Working Group, October, 20, 2004Google Scholar
  23. 23.
    UTMI+ Specification, Revision 1.0, February 25, 2004Google Scholar
  24. 24.
    TPS65950 Integrated Power Management/Audio Codec, Texas Instruments, SWCS034A, May 2008Google Scholar
  25. 25.
    FT232R USB UART IC, Data Sheet Version 2.13, Future Technology Devices International Ltd, 2015Google Scholar
  26. 26.
    CY7C68013A/CY7C68014A, CY7C68015A/CY7C68016A EZ-USB FX2LP™ USB Microcontroller, Cypress Semiconductor Corporation, 04/18/2005Google Scholar
  27. 27.
    USB ECN, Interface Association DescriptorsGoogle Scholar
  28. 28.
    USB Interface Association Descriptor Device Class Code and Use Model, Intel Corporation, Rev 1.0, July 23, 2003Google Scholar
  29. 29.
    Universal Serial Bus Class Definitions for Communications Devices, Rev 1.2, November 3, 2010Google Scholar
  30. 30.
    Universal Serial Bus Communications Class Subclass Specification for PSTN Devices, Rev 1.2, February 9, 2007Google Scholar
  31. 31.
    Crystal LAN™ CS8900A Ethernet Controller Technical Reference Manual, AN83REV3, Cirrus Logic, Inc. June 2001Google Scholar
  32. 32.
    DM9000 ISA to Ethernet MAC Controller with Integrated 10/100 PHY, Version DM9000-DS-F03, DAVICOM Semiconductor, Inc., April 23, 2009Google Scholar
  33. 33.
    DM9000 32/16/8 bit Three-In-One Fast Ethernet Controller Application Notes V1.22, Version DM9000-AP-1.22, June 11, 2004Google Scholar
  34. 34.
    LAN9221/LAN9221i, High-Performance 16-bit Non-PCI 10/100 Ethernet Controller with Variable Voltage I/O, Rev 2.8, Standard Microsystems Corp. (SMSC), July 14, 2011Google Scholar
  35. 35.
    DP83848C PHYTER®—Commercial Temperature Single Port 10/100 Mb/s Ethernet Physical Layer Transceiver, National Semiconductor Corporation, May 2008Google Scholar
  36. 36.
    DP83848T PHYTER® Mini-Industrial Temperature Single 10/100 Ethernet Transceiver, National Semiconductor Corporation, May 2008Google Scholar
  37. 37.
    Triple-Speed Ethernet MegaCore Function User Guide, Software Version: 11.0, Altera Corporation, June 2011Google Scholar
  38. 38.
    88E1111 Product Brief, Integrated 10/100/1000 Ultra Gigabit Ethernet Transceiver, Marvell Semiconductor, Inc., March 4, 2009Google Scholar
  39. 39.
    Use The MDIO Bus To Interrogate Complex Devices, Electronic Design, December 3, 2001Google Scholar
  40. 40.
    IEEE Std 802.3™-2008, IEEE Standard for Information technology—Telecommunications and Information Exchange Between Systems—Local and Metropolitan Area Networks—Specific requirements Part 3: Carrier sense multiple access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications, IEEE Computer Society, December 26, 2008Google Scholar
  41. 41.
    Serial-GMII Specification, Document Number ENG-46158, Revision 1.8, Yi-Chin Chu, Cisco Systems, November 2, 2005Google Scholar
  42. 42.
    Intel 8080 Microcomputer Systems User’s Manual, September 1975Google Scholar
  43. 43.
    MC6800 8-bit Microprocessing Unit (MPU), Motorola Semiconductor Products Inc., 1984Google Scholar
  44. 44.
    M6800 Programming Reference Manual, First Edition, Motorola, Inc., 1976Google Scholar
  45. 45.
    AN10880, Using the LCD Interface in the LPC313x/LPC314x/LPC315x Devices, Rev.01, NXP Semiconductors, October 21, 2009Google Scholar
  46. 46.
    Universal Serial Bus 3.1 Specification, Rev 1.0, Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, Renesas Corporation, ST-Ericsson, Texas Instruments, July 26, 2013Google Scholar
  47. 47.
    Universal Serial Bus Power Delivery Specification, Revision 2.0, V1.1. 7, May, 2015Google Scholar
  48. 48.
    Universal Serial Bus Type-C Cable and Connector Specification, Revision 1.1, April 3, 2015Google Scholar
  49. 49.
    Aardvark I2C/SPI Host Adapters User Manual V5.15, Total Phase, Inc., February 28, 2014Google Scholar
  50. 50.
  51. 51.
    Phase Locked Loop (ALTPLL) Megafunction User Guide, Altera Corporation, November, 2009Google Scholar
  52. 52.
    Digital Integrated Circuits: A Design Perspective (2nd Edition). Jan M. Rabaey, Anantha Chandrakasan, Borivoje Nikolic, Pearson Education, Inc., 2003Google Scholar
  53. 53.
    Silicon VLSI Technology: Fundamentals, Practice and Modeling. James D. Plummer, Michael D. Deal, Peter B. Griffin, Prentice Hall, Inc., 2000Google Scholar

Copyright information

© Changyi Gu 2016

Authors and Affiliations

  • Changyi Gu
    • 1
  1. 1.San DiegoUSA

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