Abstract
As lithographic dimensions progress through sub-micron sizes, the effect of contamination becomes more severe. The occurance of small particulates rises rapidly as their size decreases, not only because of the larger number of small airborne particulates but also because of the particulates from tools and semiconductor materials. Even with better clean rooms, this larger defect density can cause drastic yield reductions unless specific measures are taken to reduce its impact.
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© 1990 Springer Science+Business Media New York
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Mauer, J., Seeger, D., DellaGuardia, R. (1990). Yield Improvement Through X-RAY Lithography. In: Stapper, C.H., Jain, V.K., Saucier, G. (eds) Defect and Fault Tolerance in VLSI Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9957-6_17
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DOI: https://doi.org/10.1007/978-1-4757-9957-6_17
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