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Advances in Cryogenic Engineering Materials pp 1257–1264Cite as

Jumps of the Local Magnetic Field Near CICC during External Magnetic Field Ramp and Their Connection with the Ramp Rate Limitation

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Part of the book series: Advances in Cryogenic Engineering ((ACRE,volume 42))

Abstract

A new method has been developed to study Ramp Rate Limitation (RRL) phenomena.1 Samples of ITBR-type cable-in-conduit (CICC) subcable were instrumented with local field sensors such as Hall probes and pick-up coils and then subjected to rapidly changing external magnetic field. We found that during fast field sweeps some discontinuous changes, or jumps occur in the local field. We believe that these jumps indicate a fast current redistribution processes inside CICC. Detailed information about local magnetic field jumps during changing field is presented. Possible origin of the jumps and their connection with RRL are discussed.

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References

  1. V.S. Vysotsky et al. IEEE Trans. on Applied Superconductivity, 5:580, (1995)

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Author information

Authors and Affiliations

  1. Plasma Fusion Center, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA

    V. S. Vysotsky, M. Takayasu & J. V. Minervini

  2. RSC Kurchatov Institute, Moscow, Russia

    V. S. Vysotsky

Authors
  1. V. S. Vysotsky
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  2. M. Takayasu
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  3. J. V. Minervini
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Editor information

Editors and Affiliations

  1. Lawrence Livermore National Laboratory, University of California, Livermore, California, USA

    Leonard T. Summers

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© 1996 Springer Science+Business Media New York

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Vysotsky, V.S., Takayasu, M., Minervini, J.V. (1996). Jumps of the Local Magnetic Field Near CICC during External Magnetic Field Ramp and Their Connection with the Ramp Rate Limitation. In: Summers, L.T. (eds) Advances in Cryogenic Engineering Materials . Advances in Cryogenic Engineering Materials , vol 42. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9059-7_163

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  • DOI: https://doi.org/10.1007/978-1-4757-9059-7_163

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9061-0

  • Online ISBN: 978-1-4757-9059-7

  • eBook Packages: Springer Book Archive

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