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Multilayer Nb-Ti for Use as Model Superconducting Microstructures

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Advances in Cryogenic Engineering Materials

Part of the book series: Advances in Cryogenic Engineering ((ACRE,volume 42))

Abstract

Thin film deposition techniques provide opportunities to control the microstructure of two-phase alloy superconductors more completely than that possible by conventional metallurgical processing. We have fabricated thin film multilayer structures based on Nb-Ti alloy superconductors. The goal is to provide model microstructures that can be easily compared to flux-pinning theories of high-critical-current superconductivity. In this study, multilayer Nb/Ti materials have been annealed to provide samples with a variety of superconducting / normal interfaces, ranging from atomically sharp interfaces to heavily inter-diffused interfaces. Measurements of electrical and microstructural properties are described and compared with model predictions from proximity coupling theory and alloy diffusion.

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References

  1. M. A. Wall, Microscopy Research and Technique, 27: 262 (1994).

    Article  CAS  Google Scholar 

  2. C. C. Koch, J. O. Scarbrough, D. M. Krocger, Phys Rev B, 9: 888 (1974).

    Article  CAS  Google Scholar 

  3. L. R. Testardi, J. M. Poatc, H. J. Levinstein, Phys Rev B, 15(5): 2570 (1976).

    Article  Google Scholar 

  4. J. C. Villegier, J. C. Veler, IEEE Trans Mag, 19(3): 946 (1983).

    Article  Google Scholar 

  5. Y. J. Qian, J. Q. Zheng, B. K. Sarma, H. Q. Yang, J. B. Ketterson, and J. H. Hilliard, J Low Temp Phys, 49(3): 279 (1982).

    Article  CAS  Google Scholar 

  6. N. Sato, J Appl Phys, 67: 7493 (1990).

    Article  CAS  Google Scholar 

  7. Y. Obi, M. Ikebe, Y. Muto, H. Fujimori, Jap J Appl Phys, 26(3)4445 (1987).

    Google Scholar 

  8. C. Meingast, P. J. Lee, D. C. Larbalestier, J Appl Phys, 66: 5962 (1989).

    Article  CAS  Google Scholar 

  9. M. Ledvij, L. Dobrosavljevic-Grujic, and J. R. Clem, Phys Rev B, 38(1): 129 (1988).

    Article  Google Scholar 

  10. G. B. Gibbs, D. Graham, D. H. Tomlin, Phil Mag, 8: 1269 (1963).

    Article  CAS  Google Scholar 

  11. J. A. Norris, “Properties of a Niobium-Titanium Multilayer Thin Film”, M.S. Thesis, Oregon State University, Corvallis, OR (1995).

    Google Scholar 

  12. J. Q. Zheng, J. B. Ketterson, C. M. Falco, I. K. Schuller, Physica, 108(B): 945 (1981).

    Article  CAS  Google Scholar 

  13. Z. Fisk, A. C. Lavvson, Sol State Comm, 13: 277 (1973).

    Article  CAS  Google Scholar 

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© 1996 Springer Science+Business Media New York

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Warnes, W.H., Faase, K.J., Norris, J.A. (1996). Multilayer Nb-Ti for Use as Model Superconducting Microstructures. In: Summers, L.T. (eds) Advances in Cryogenic Engineering Materials . Advances in Cryogenic Engineering Materials , vol 42. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9059-7_149

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  • DOI: https://doi.org/10.1007/978-1-4757-9059-7_149

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9061-0

  • Online ISBN: 978-1-4757-9059-7

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