Abstract
Electronic subsystems operating at temperatures significantly below room temperature offer a wide variety of opportunities for performance improvements at lower operational power and smaller size. Semiconducting materials operate at higher speeds with low power consumption; superconducting materials offer zero (low) resistance for interconnects, coils and filters as well as quantum properties for switching and logic elements, and electromagnetic detectors; and magnetic materials offer the possibility of spin-polarized devices. Key issues in the acceptance of cryo-electronics for commercial and military applications are: i) affordable, improved materials coupled with a viable materials integration technology, ii) total systems design which takes advantage of the improved material performance, and iii) affordable, reliable, efficient refrigerators coupled with systems integration. The first and second, (i) and (ii), focus on performance issues necessary to demonstrate the promise of cryo-electronics while the last, (iii), focuses on the challenge of acceptance by a community who does not want the “baggage” of the cryogenic environment to be noticeable.
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References
For a review of Low Temperature Electronics, see: Proceedings of “1st International Low Temperature Electronics Conference,” Cryogenics 30 December 1990.
For a review of High Speed ICs and Systems see: R.C. Eden “Applicability of Superconducting Interconnection Technology for High Speed ICs and Systems” Final Reports on DARPA BAA 90–06 contract N00014–90-C-0217, October 1991 and 1992. Available from Quad Design Technology, 1385 Del Norte Road, Camarillo, CA 93010.
IEEE Trans. Electron Devices (1987) ED34(1).
For a review of the field of superconducting electronics see: IEEE Transactions on Applied Superconductivity, June 1995, vol. 5 Parts I and III.
For a review of the field of magneto-electronics see: G.A. Prinz, Physics Today, April 1995, p. 58.
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© 1996 Springer Science+Business Media New York
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Gubser, D.U. (1996). Cryo-Electronics: The Promise and the Challenge. In: Summers, L.T. (eds) Advances in Cryogenic Engineering Materials . Advances in Cryogenic Engineering Materials , vol 42. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9059-7_130
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DOI: https://doi.org/10.1007/978-1-4757-9059-7_130
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