Thermal Contraction Coefficient Measurement Technique of Several Materials at Low Temperatures Using Electronic Speckle Pattern Interferometry

  • S. Nakahara
  • S. Nishida
  • S. Hisada
  • T. Fujita
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 44)


Electronic speckle pattern interferometry has been applied to the measurement of the thermal expansion coefficient of a sample in the form of a plate of several commercial available metallic materials at low temperatures. Interference fringe patterns are mapping contours of constant in-plane displacement difference between two temperatures. They are dependent on the cooling rate and the temperature gradient of the specimen. The fringe separation shows the thermal strain. The temperature of specimens are simultaneously monitored using thermocouples during the cooling process. Analysis of the thermal strains and temperatures allows for the measurement of the thermal expansion of the specimen.


Thermal Expansion Coefficient Ofthermal Expansion Coefficient Fringe Pattern Thermal Strain Thermal Contraction 
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Copyright information

© Springer Science+Business Media New York 1998

Authors and Affiliations

  • S. Nakahara
    • 1
  • S. Nishida
    • 1
  • S. Hisada
    • 1
  • T. Fujita
    • 1
  1. 1.Dept. of Mechanical EngineeringKansai UniversitySuita, OsakaJapan

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