Abstract
Electronic speckle pattern interferometry has been applied to the measurement of the thermal expansion coefficient of a sample in the form of a plate of several commercial available metallic materials at low temperatures. Interference fringe patterns are mapping contours of constant in-plane displacement difference between two temperatures. They are dependent on the cooling rate and the temperature gradient of the specimen. The fringe separation shows the thermal strain. The temperature of specimens are simultaneously monitored using thermocouples during the cooling process. Analysis of the thermal strains and temperatures allows for the measurement of the thermal expansion of the specimen.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
K. A. Stetson, The use of heterodyne speckle photogrammetry to measure high temperature strain distributions, Proc. Soc. Photo-Opt. Instrum. Eng., 370: 46–54 (1983).
W. Jiang, A. Kawasaki, K. Date, and R. Watanabe, Measurement of thermal expansion coefficient of Mo/PSZ sintered composites by laser speckle photography. J. Japan Inst. Metals, 58: 835–841 (1994) (in Japanese).
F. Salazar and F. GascOn, Thermal expansion coefficient measurement by double- exposure speckle photography, Optics Communications, 103: 235–244 (1993).
S. Nakahara, Y. Maeda, K. Matsumura, S. Hisada, T. Fujita, and K. Sugihara, Deformation measurements of materials at low temperatures using laser speckle photography method, Advances in Cryogenic Engineering (Materials), 38: 85–92 (1992).
S. R. Sirohi, in: Speckle Metrology, Marcel Dekker. Inc., New York (1993) 67. 100.
S. Nakahara, S. Sakiyama, S. Hisada, and T. Fujita, Strain measurements of stainless steel at low temperatures using electronic speckle pattern interfcrometry, Proceeding of thel6th ICEC/ICMC, Elsevier (1997) 665–668.
J. T. Malmo, O. J. Lokberg, and G. A. Slettemoen, Intcrferometric testing at very high temperatures by TV-holography, Exp. Mech., 28: 315–321 (1988).
A. J. Moor and J. R. Tyrer, Two-dimensional strain measurement with ESPI, Optics and Lasers in Engineering, 24: 381–402 (1996).
Y. S. Touloukian, in: Thermophysical properties of matter Vol. 12, Thermal Expansion, Metallic Elements and Alloys, IFI/Plenum New York-Washington. (1975)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1998 Springer Science+Business Media New York
About this chapter
Cite this chapter
Nakahara, S., Nishida, S., Hisada, S., Fujita, T. (1998). Thermal Contraction Coefficient Measurement Technique of Several Materials at Low Temperatures Using Electronic Speckle Pattern Interferometry. In: Balachandran, U.B., Gubser, D.G., Hartwig, K.T., Reed, R.P., Warnes, W.H., Bardos, V.A. (eds) Advances in Cryogenic Engineering Materials . Advances in Cryogenic Engineering, vol 44. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9056-6_47
Download citation
DOI: https://doi.org/10.1007/978-1-4757-9056-6_47
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4757-9058-0
Online ISBN: 978-1-4757-9056-6
eBook Packages: Springer Book Archive