Materials pp 429-435 | Cite as

Friction and Wear of a Three-Dimensional Fabric-Reinforced Plastic at Room Temperature and Liquid Nitrogen Temperature

  • S. Nishijima
  • T. Okada
  • P. C. Michael
  • Y. Iwasa
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 38)


The friction and wear characteristics for copper slid against ZI-005, a newly-developed, three-dimensional-fabric-reinforced plastic, were examined at room temperature (300 K) and at liquid nitrogen temperature(77 K) to determine its suitability for use in cryogenically-cooled electromagnets. For comparison, the friction and wear characteristics for copper slid against G-10, a conventional two-dimensional-fabric-reinforced plastic,were also measured. The friction coefficient for the copper/G-10 pair increased markedly with sliding distance at 300K, achieving a steady-state value of 0. 75; at 77K the friction coefficient is much lower, ~0. 3, and relatively independent of distance. By contrast, the friction coefficient for copper/ZI-005 is equal to ~0. 5, independent of both sliding distance and temperature. The magnitude of the nondimensional wear coefficients for copper/ZI-005 are equal to ~10−4, independent of temperature, and are approximately 100 times greater than those for copper/G-10(~10−6). The magnitude of these wear coefficients, together with an examination of the composites’ surface morphologies, suggest that the surface interactions for copper/ZI-005 are predominantly abrasive, whereas the interactions for copper/G-10 are generally adhesive. Because of its tendency towards abrasive friction, ZI-005 should provide a much stabler friction behavior when used as an insulator between highly-stressed copper windings.


Friction Coefficient Wear Scar Adhesive Wear Wear Characteristic Frictional Behavior 
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Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • S. Nishijima
    • 1
  • T. Okada
    • 1
  • P. C. Michael
    • 2
  • Y. Iwasa
    • 2
  1. 1.ISIR Osaka UniversityIbaraki OsakaJapan
  2. 2.FBNML MITCambridgeUSA

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