Abstract
Wireless products employing high temperature superconductors (HTS) and cryoelectronics are being sold in the commercial and military marketplace. Product requirements for reliability and cost are driving the configuration of the cryopackage. Engineering challenges for vacuüm life, cryocooler reliability, cryoelectronics reliability, and HTS device reliability must be met within cost goals for the products to be viable in the long term. This paper discusses requirements and design approaches for wireless device cryopackaging.
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© 1998 Springer Science+Business Media New York
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Lehmann, G., Ramsden, J., Sochor, J., Beeck, G. (1998). Cryopackaging for Real World Products. In: Kittel, P. (eds) Advances in Cryogenic Engineering. Advances in Cryogenic Engineering, vol 43. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9047-4_108
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DOI: https://doi.org/10.1007/978-1-4757-9047-4_108
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4757-9049-8
Online ISBN: 978-1-4757-9047-4
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