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Surface Characterization in Polymer/Metal Adhesion

  • Chapter
Adhesive Bonding

Abstract

Adhesion involves a detailed understanding of polymer synthesis and characterization, mechanics, and surfaces. This chapter reviews surface analysis and interphase analysis emphasizing polymer/metal systems. The interphase is a thin region between the bulk adherend and the bulk adhesive, as depicted in Figure 1. A surface oxide, either native or one produced by pre-treatment, is present on most metal adherends. A primer is often applied in a production process after pretreatment and before the application of an adhesive. Typical thicknesses for the oxide are 0.003–0.4 µm, for the primer 4 µm (0.16 mil), and for the adhesive 40 µm (1.6 mil). The interphase region is expected to have mechanical properties different from either the adherend or the adhesive. Measurement of these properties is important in understanding adhesion, for example, poorly durable bonds are often a consequence of poor interphase properties.(1,2) Thus, one of the frontier areas in adhesion science today is determining interphase properties.

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Author information

Authors and Affiliations

  1. Finish Group, Hoechst Celanese, Charlotte, North Carolina, 28232-2414, USA

    Jennifer A Filbey

  2. Center for Adhesive and Sealant Science and Chemistry Department, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, 24061, USA

    James P. Wightman

Authors
  1. Jennifer A Filbey
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  2. James P. Wightman
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Editor information

Editors and Affiliations

  1. Xerox Corporation, Webster, New York, USA

    Lieng-Huang Lee

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© 1991 Springer Science+Business Media New York

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Filbey, J.A., Wightman, J.P. (1991). Surface Characterization in Polymer/Metal Adhesion. In: Lee, LH. (eds) Adhesive Bonding. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9006-1_7

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  • DOI: https://doi.org/10.1007/978-1-4757-9006-1_7

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9008-5

  • Online ISBN: 978-1-4757-9006-1

  • eBook Packages: Springer Book Archive

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