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The Coupling of Interfacial, Rheological, and Thermal Control Mechanisms in Polymer Adhesion

  • Chapter
Adhesive Bonding

Abstract

It is easy to see, intuitively, that the adhesion of a polymer to a solid is profoundly influenced both by the rheological properties of the polymer and by the thermodynamic properties (free energy of adhesion) of the polymer/solid interface. But just how these properties are coupled has not been clear. If this problem of coupling can be solved, it should become possible to elucidate some important aspects of adhesion that have defied analysis, up to the present.

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Authors and Affiliations

  1. Department of Chemical Engineering, State University of New York at Buffalo, Buffalo, New York, 14260, USA

    Robert J. Good & Rakesh K. Gupta

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  1. Robert J. Good
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  2. Rakesh K. Gupta
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Editor information

Editors and Affiliations

  1. Xerox Corporation, Webster, New York, USA

    Lieng-Huang Lee

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© 1991 Springer Science+Business Media New York

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Good, R.J., Gupta, R.K. (1991). The Coupling of Interfacial, Rheological, and Thermal Control Mechanisms in Polymer Adhesion. In: Lee, LH. (eds) Adhesive Bonding. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9006-1_3

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  • DOI: https://doi.org/10.1007/978-1-4757-9006-1_3

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9008-5

  • Online ISBN: 978-1-4757-9006-1

  • eBook Packages: Springer Book Archive

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