Layering Technologies

  • Ivor Brodie
  • Julius J. Muray
Part of the Microdevices book series (MDPF)


Planar technology requires that thin layers of materials be formed and patterned sequentially, commencing with a flat rigid substrate. The key aspects of each layer are its
  • Thickness

  • Interface properties

  • Structure, composition, and topography

  • Electronic properties

  • Optical properties

  • Mechanical properties

  • Chemical properties


Epitaxial Layer Gallium Arsenide Laser Annealing proJected Range Recoil Atom 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Ivor Brodie
    • 1
  • Julius J. Muray
    • 1
  1. 1.SRI InternationalMenlo ParkUSA

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