As microelectronic fabrication capabilities evolve to astounding levels of submicron technology, more and more functions can be integrated on-chip. Industries such as telecommunications and consumer electronics are witnessing a rapid evolution to entire systems being placed on a single die.


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Copyright information

© Springer Science+Business Media Dordrecht 1997

Authors and Affiliations

  • Clifford Liem
    • 1
  1. 1.Laboratoire TIMA & SGS-Thomson MicroelectronicsGrenobleFrance

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