Abstract
Porous silicon was proposed since 1994 for micromachining, but at first only for sacrificial layers [193–198]. Lehmann considered it as new base material for MEMS using the high internal surface of macropores in 1996 [228]. Tjerkstra combined porosification and electropolishing of Si to form free-standing layers of porous Si to separate concentric microchannels [229] and uses isotropic electropolishing to micromachine buried microchannels [230]. All the devices have in common that they are mechanically static.
Scheele and many later investigators, including Davy, Gay-Lussac, Lavoisier, and Thenard experimented with hydrofluoric acid, some experiments ending in tragedy.
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© 2002 Springer Science+Business Media New York
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Lammel, G., Schweizer, S., Renaud, P. (2002). Micromachining Using Porous Silicon. In: Optical Microscanners and Microspectrometers using Thermal Bimorph Actuators. Microsystems, vol 14. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-6083-5_7
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DOI: https://doi.org/10.1007/978-1-4757-6083-5_7
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