Abstract
A single-crystalline, single-wafer micro-gyroscope is fabricated using the Sur- face/Bulk Micromachining (SBM) process. The structural thickness of fabricated micro-gyroscope is 40 µm, and the sacrificial gap is 50 µm. For electrostatic actuation and capacitive sensing a new electrical isolation method, which uses a triple film composed of oxide, polysilicon and metal films, is developed. Two versions of gyroscopes are developed. In one version, the measured noise-equivalent angular rate resolution is 0.01°/sec, the input range is ±20°/sec, and the measured bandwidth is 16 Hz. In the second version, the measured values are 0.024o/sec, ±50°/sec, and 33 Hz, respectively. The angle random walk for versions one and two are 0.0025°/ sec/√Hz and 0.0042°/sec/√Hz, respectively. These performance specifications put the SBM fabricated MEMS gyroscopes in the “tactical grade”.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
B. Diem, M.T. Delaye, F. Michel, S. Renard and G. Delapoerre. SOI (SIMOX) as a substrate for surface micromachining of single crystalline silicon sensors and actuators. Transducers’93, Yokohama, Japan, 233 – 236.
Geiger, B. Folkmer, J. Merz, H. Sandmaier and W. Lang. A new silicon rate gyroscope. IEEE MEMS’98, Heidelberg, Germany, 615 – 620.
S. Baek, Y. S. Oh, B. J. Ha, S. D. An, B. H. An, H. Song and C. M. Song. A symmetrical z-axis gyroscope with a high aspect ratio using simple and new process. IEEE MEMS’ 99, Orlando, USA, 612 – 617.
S. Lee, S. Park and D. Cho. A new micromachining technology using (111) silicon. Digest of Papers on Microprocess and Nano-Technology Conference, Kyongju, Korea, 1999; 174–175 (also in Japanese Journal of Applied Physics, 1999; 38: 2699–2703 ).
S. Park, S. Lee, S. Yi and D. Cho. Mesa-supported, single-crystal microstructures fabricated by the Surface/Bulk Micromachining (SBM) Process. Japanese Journal of Applied Physics, 1999; 38: 4244–4249.
S. Lee, S. Park, S. Yi, S. Lee, D. Cho, B. Ha, Y. Oh and C. Song. Electrostatic actuation of surface/ bulk micromachined single-crystal silicon microresonators. Proceedings of IEEE/RSJ International Conference on Intelligent Robots and Systems, Kyongju, Korea, 1999; 2: 1057–1062.
S. Lee, S. Park and D. Cho. Surface/Bulk Micromachining (SBM) process and deep trench oxide isolation method for MEMS. International Electron Devices Meeting, Washington D. C., USA, 1999; 701 – 704.
S. Lee, S. Park and D. Cho. The Surface/Bulk Micromachining (SBM) process: a new method for fabricating released, microelectromechanical systems in single crystal silicon. IEEE/ASME Journal of Microelectromechanical Systems, 1999; 8: 409–416.
D. Cho, S. Lee and S. Park. Surface/bulk micromachined high performance silicon micro-gyroscope. 2000 Solid-state Sensor and Actuator Workshop (Hilton Head), Late News Paper, Hilton Head Island, SC, USA, 1– 2.
S. Lee, S. Park, J. Kim, S. Yi and D. Cho. Surface/bulk micromachined single-crystalline silicon micro-gyroscope IEEE/ASME Journal of Microelectromechanical Systems, 2000; 9: 557–567.
S. Lee, S. Park and D. Cho. Honeycomb-shaped deep-trench oxide posts for micromachining single-crystal without using SOI. Transducers 2001, Munich, Germany, 2001; 1124–1127.
J. Kim, D. Cho and R. S. Muller. Why is (111) silicon a better mechanical material for MEMS. Transducers 2001, Munich, Germany, 2001; 662–665.
J Kim and D. Cho. An extended double-SBM process for vertical actuation and sensing using one single-crystalline silicon wafer. International MEMS Workshop 2001, Singapore, 2001; 291–298.
S. Park, S. Lee, J. Kim, S. Lee and D. Cho. Tactical grade MEMS gyroscope fabricated by the SBM process. International MEMS Workshop 2001, Singapore, 2001; 168–177.
K. A. Shaw, Z. L. Zhang and N. C. MacDonald. SCREAM I: a single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structures. Sensors and Actuators A, 1994; 40: 63–70.
U. Sridhar, et. al. Trench oxide isolated single crystal silicon micromachined accelerometer. IEEE Electron Devices Meeting, San Francisco, USA, 1998; 475–478.
Y. Mochida, M. Tamura and K. Ohwada. A micromachined vibrating rate gyroscope with independent beams for the drive and detection modes IEEE MEMS’99, Orlando, USA, 1999; 618–623.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2002 Springer Science+Business Media New York
About this chapter
Cite this chapter
Dan Cho, Di., Park, S., Kim, J., Lee, S., Lee, S.W. (2002). Tactical Grade MEMS Gyroscopes Fabricated by the SBM Process. In: Tay, F.E.H. (eds) Materials & Process Integration for MEMS. Microsystems, vol 9. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-5791-0_13
Download citation
DOI: https://doi.org/10.1007/978-1-4757-5791-0_13
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4419-5303-2
Online ISBN: 978-1-4757-5791-0
eBook Packages: Springer Book Archive