Abstract
The delamination strength of PC/SAN microlayers was measured with the T-peel test. To evaluate the contribution of crazing to delamination, the effects of PC and SAN layer thicknesses on the delamination strength were examined using SAN with 25% AN. The SAN layer thickness determined whether the crack propagated along a PC-SAN interface (interfacial delamination) or through crazes within an SAN layer (craze delamination). Only interfacial delamination was observed if the SAN layers were thinner than 1.5 gm. The thickness of the PC layers determined whether the crack propagated along a single layer or jumped from one layer to the next. Both SAN crazing and crack jumping increased the measured delamination strength. The effect of AN content of the SAN was studied in microlayers with SAN layers thin enough to exhibit interfacial delamination. The results confirmed an optimum AN content for maximum PC-SAN adhesion in the range of 20–25%. The effect of AN content on craze delamination was subsequently studied using microlayers with thicker SAN layers. The results indicated that the dependence of delamination strength on AN content was exaggerated when both cohesive and adhesive modes contributed to delamination failure.
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Hiltner, A., Ebeling, T., Shah, A., Mueller, C., Baer, E. (1997). Strength of the PC-SAN Interface as Determined by Delamination of Polymer Microlayers. In: Lohse, D.J., Russell, T.P., Sperling, L.H. (eds) Interfacial Aspects of Multicomponent Polymer Materials. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-5559-6_9
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DOI: https://doi.org/10.1007/978-1-4757-5559-6_9
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