MOSFET High-Voltage Technologies

  • Hussein Ballan
  • Michel Declercq
Chapter

Abstract

The existing solutions avoiding the different undesirable effects presented in the previous chapter are discussed here. These solutions are distinguished first at a device level where the isolated vertical and lateral DMOSFET structures are presented. Then, the corresponding high-voltage technologies are discussed according to the isolation technique used between devices. A rough presentation of the high-voltage technologies based on the p-n junction isolation and the dielectric isolation techniques is performed. The former are more commonly known as BCD (Bipolar CMOS and DMOS) technologies and start with a bipolar basis. The latter require tricky mechanical processing of the starting material. Interest is focused on the high-voltage technologies using a CMOS basis, where the required supplementary masks and processing steps are added to implement the high-voltage devices.

Keywords

Epitaxial Layer Breakdown Voltage Depletion Layer Bipolar Transistor Doping Profile 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media Dordrecht 1999

Authors and Affiliations

  • Hussein Ballan
    • 1
  • Michel Declercq
    • 1
  1. 1.Swiss Federal Institute of TechnologyLausanneSwitzerland

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