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Processing Plasmas and Reactors

  • Srinivasan Sivaram

Abstract

In our discussion of the fundamental characteristics of plasmas, we did not place emphasis on the means of generating and sustaining the plasma. Nor did we consider the proper confinement of the plasma and the reactants, or the optimization of the plasma in order to produce a solid film on the substrate. In this chapter we will address these issues and study the coupling of external power to the discharge for its generation and maintenance. We will use a simple DC diode plasma in order to illustrate electron production and loss mechanisms. However, since most useful CVD processes use AC power sources, we will also examine RF and microwave discharges.

Keywords

Electron Cyclotron Resonance Microwave Discharge Step Coverage Electron Cyclotron Resonance Heating Electron Cyclotron Resonance Plasma 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1995

Authors and Affiliations

  • Srinivasan Sivaram

There are no affiliations available

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