This chapter is different from the rest of the book. It is not directly pertinent to the art or science of CVD; instead it deals with the development process. It provides a framework to increase the efficiency with which processes can be made manufacturable. I believe this framework should be a prerequisite for all process/equipment engineers who hope to work in the microelectronic industry.
KeywordsChemical Vapor Deposition Control Chart Passivation Film Microelectronic Industry Step Coverage
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- 1.Project Management“, Class Notes, Integrated Project Systems, Inc., 1070 6th Ave # 112, Belmont, CA 94002.Google Scholar
- 2.D. C. Montgomery, Design and Analysis of Experiments, John Wiley, New York, 1976.Google Scholar
- 3.G. E. P. Box, W. G. Hunter, and J. S. Hunter, Statistics for Experimentors, John Wiley, New York, 1978Google Scholar
- 4.W. J. Diamond, Practical Experimental Designs, Van Nostrand Reinhold, New York, 1981.Google Scholar
- 5.A. R. Alvarez, D. J. Walters, and M. Johnson, Solid State Technol. 26 (7), 127 (1983).Google Scholar
- 6.International Business Machines Corp., Process Control, Capability and Improve-ment, The Quality Institute, Southbury, Conn., 1984.Google Scholar
- 7.C. E. Morosanu, Thin Films by Chemical Vapor Deposition, Elsevier, Amsterdam, 1990.Google Scholar
- 8.W. Kern, and V. S. Ban, in Thin Film Processes (Vossen and Kern, Eds.), p. 258, Academic Press, New York, 1978.Google Scholar
- 9.R. Reif, XXX, in Handbook of Plasma Processing Technology (Rossnagel, Cuomo, and Westwood, Eds.), p. 260, Noyes, Park Ridge, N. J., 1990.Google Scholar
- 10.R. Solanki, C. A. Moore, and G. J. Collins, Solid State Technol. 28 (6), 220 (1985).Google Scholar
- 11.J. Peters, F. Gebhardt, and T. Hall, Solid State Technol. 23(9), 121 (1980).Google Scholar