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Introduction to the IEEE 1149.4

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Part of the book series: Frontiers in Electronic Testing ((FRET,volume 16))

Abstract

Figure 1.1 represents an electrical circuit constructed as a printed circuit assembly (PCA) consisting of a substrate carrying a pattern of conductors (the interconnect) on which separately manufactured components are mounted so that the component pins make electrical contact with the interconnect. In normal functional operation, the PCA connects to other parts of the system by way of a set of contacts such as the edge-connector shown in Figure 1.1.

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References

  1. J. Baston, “In-Circuit Testing”, Van Nostrand Reinhold, New York, 1985

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  2. K.P. Parker, “The Boundary-Scan Handbook, 2nd Edition, Analog and Digital”, Kluwer Academic Publishers, Boston, 1998

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© 1999 Springer Science+Business Media Dordrecht

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Wilkins, B.R. (1999). Introduction to the IEEE 1149.4. In: Osseiran, A. (eds) Analog and Mixed-Signal Boundary-Scan. Frontiers in Electronic Testing, vol 16. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-4499-6_1

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  • DOI: https://doi.org/10.1007/978-1-4757-4499-6_1

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4419-5115-1

  • Online ISBN: 978-1-4757-4499-6

  • eBook Packages: Springer Book Archive

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