Abstract
Thermal shock experiments are conducted on rectangular samples of alumina, containing controlled indentation flaws, using an apparatus with in situ acoustic emission (AE) allowing unstable crack propagation detection. Fracture mechanical analysis, combined with AE measurements is applied to investigate crack growth resistance under thermal shock and thermal fatigue behaviour of alumina ceramics with different microstructures.
As in bending tests, the coarse grained material showed a more pronounced R-curve behaviour than the fine grained material. The results are discussed considering the influence of the R curve behaviour on the retained strength after thermal shock.
A set of samples were thermally cycled at the same applied temperature difference ΔT, and the plot of the critical cycle number for which unstable crack propagation occured, versus the initial crack size allowed the determination of a thermal fatigue domain in the V-K1 diagram (crack growth rate versus the stress intensity factor). Comparison with subcritical crack growth (SCG) laws obtained under isothermal mechanical loading reveals cyclic fatigue effects and shows that life time prediction cannot be done simply from the mechanical results.
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© 2002 Springer Science+Business Media New York
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Saâdaoui, M., Chevalier, J., Fantozzi, G. (2002). Thermal Shock and Thermal Fatigue of Alumina Ceramics. In: Bradt, R.C., Munz, D., Sakai, M., Shevchenko, V.Y., White, K. (eds) Fracture Mechanics of Ceramics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-4019-6_30
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DOI: https://doi.org/10.1007/978-1-4757-4019-6_30
Publisher Name: Springer, Boston, MA
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