Thermal monitoring of IC’s

  • Josep Altet
  • Antonio Rubio


The feasibility of the different thermal testing procedures is inherently linked to the existence and performance of temperature monitoring techniques. The purpose of monitoring the temperature of an integrated circuit is to obtain an image of the thermal map (the spatial distribution of temperature) of its surface. This map can cover the entire surface, or merely a region of it. It can be continuous (with a given spatial and thermal resolution) or discrete (temperatures at a finite and specific number of points on the surface). The map can be full static (DC) or dynamic (AC) with a given bandwidth. The data of this map can be processed later to generate a detailed thermal analysis which, if compared to reference maps or using its dynamic behaviour, can be used to distinguish defective devices from fully operative ones. In this chapter we will classify the main measuring methods into three domains, depending on the way in which the measurement is taken: by optical, mechanical or built-in temperature sensors.


Liquid Crystal Heat Source Temperature Sensor Bipolar Transistor Liquid Crystal Cell 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer Science+Business Media Dordrecht 2002

Authors and Affiliations

  • Josep Altet
    • 1
  • Antonio Rubio
    • 1
  1. 1.University Politècnia de CatalunyaSpain

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