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Thermal Testing of Integrated Circuits pp 97–138Cite as

Temperature as a test observable variable in ICs

Thermal testing

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Abstract

Temperature is a physical magnitude that has been used as a parametric test observable for IC’s in different scenarios. In the 1990’s, the strategies that used temperature as a test observable were generically termed thermal testing techniques. Thermal testing can be defined as the use of temperature measuring techniques for the detection of structural defects in an IC. Such defects include structural problems in the topology of the microelectronic circuit, or the package structure (which comprises the package itself, but also the soldering integrity with the PCB and the cooling mechanisms, such as fans or radiators). In Chapter 1 the first set of defects was termed intrinsic defects, whereas the second set of defects was referred to as extrinsic defects.

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References

  1. W. Claeys, V. Quintard, S. Dilhaire and D. Lewis, “Testing of the Quality of Solder Joints through the Analysis of their Thermal Behaviour with an Interferometric Laser Probe,” Quality and Reliability Eng. International, Vol. 10, No. 3, pp. 237 - 242, May-Jun. 1994.

    Google Scholar 

  2. W. Claeys, V. Quintard, S. Dilhaire, A. Hijazi, Y. Danto, “Early Detection of Ageing in Solder Joints Through Laser Probe Thermal Analysis of Peltier Effect,” Quality and Reliability Eng. International, Vol. 10, No. 4, pp. 289 - 295, Jul.-Aug. 1994.

    Google Scholar 

  3. D.G. Fardner, J.L. Gardner, G. Lush, W. W. Meinke, “Method for the Analysis of Multicomponent Exponential Decay Curves, ”Journal of Chemical Physics, Vol. 31, pp. 978 - 986, 1959.

    Article  Google Scholar 

  4. F. Christianens, E. Beyne, “Transient Thermal Modeling and Characterization of a Hybrid Component,” 1996 Electronic Components and Technology Conference, pp. 154164.

    Google Scholar 

  5. J.W. Sofia, “Analysis of Thermal Transient Data with Synthesized Dynamic Models for Semiconductor Devices,” IEEE Transactions on Components, Packaging and Manufacturing Tech. Part A. Vol. 18, No. 1, March 1995, pp. 39 - 47.

    Article  Google Scholar 

  6. F. Christianes, B. Vandevelde, E. Beyne, R. Mertens, J. Bergmans, “A Generic Methodology for Deriving Compact Dynamic Thermal Models, Applied to the PSGA Package,” IEEE Transactions on Components, Packaging, and Manufacturing Tech. Part A. Vol. 21, No. 4, Dec. 1998, pp. 565 - 575.

    Google Scholar 

  7. V. Székely, T.V. Bien, “Fine Structure of Heat Flow Path in Semiconductor Devices: A Measurement and Identification Method,” Solid State Electronics, Vol. 31, pp. 1363 - 1368, 1988.

    Article  Google Scholar 

  8. V. Székely, M. Rencz, “Thermal Dynamics and the Time Constant Domain,” IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, Sep. 2000.

    Google Scholar 

  9. V. Székely, “Identification of RC Networks by Deconvolution: Chances and Limits,” IEEE Transactions on Circuits and Systems-:I Fundamental Theory and Applications, Vol. 45, No. 3, March 1998, pp. 244 - 258.

    Article  Google Scholar 

  10. V. Székely, “On the Representation of Infinite-Length Distributed RC One-Ports,” IEEE Transactions on Circuits and Systems, Vol. 38, No. 7, July 1991, pp. 711 - 719.

    Article  Google Scholar 

  11. V. Székely, C. Marta, M. Rencz, G. Végh, S. Török, “A Thermal Benchmark Chip: Design and Applications,” IEEE Transactions on Components, Packaging and Manufacturing Technology — Part A. Vol. 21, No. 3, Sept. 1998, pp. 399 - 405.

    Article  Google Scholar 

  12. V. Székely, M. Rencz, A. Poppe, B. Courtois, “New way for Thermal Transient Testing, ”15’h Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMITHERM 99. pp. 182 - 188.

    Google Scholar 

  13. V. Székely, M. Rencz, A. Poppe, B. Courtois, “New Hardware Tools for the Thermal Transient Testing of Packages,” Proc. 3’d Electronics Packaging Technology Conference, Singapore, Dec. 5 - 7 2000.

    Google Scholar 

  14. V. Székely, S. Ress, A. Poppe, S. Török, D. Magyari, Zs. Benedek, K. Torki, B. Courtois, M. Renz, “New Approaches in the Transient Thermal Measurements,” Microelectronics Journal 31, 2000, 727 - 733.

    Article  Google Scholar 

  15. M. Rencz, V. Székely, “Determining Partial Thermal Resistances in a Heat-Flow Path with the Help of Transient Measurements, ”Proc. 7’h THERMINIC Workshop, Paris 2001, pp. 250 - 255.

    Google Scholar 

  16. V. Székely, M. Renz, L. Pohl, “Novelties in the theory and practice of thermal transient measurements,” Proc. 7th THERMINIC Workshop, Paris 2001, pp. 239 - 244.

    Google Scholar 

  17. M. Carmona, S. Marco, J. Palacín, J. Samitier, “A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form,” IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 2, June 1999, pp. 238 - 244.

    Article  Google Scholar 

  18. T. Hopkins, R. Tiziani, “Transient Thermal Impedance Considerations in Power Semiconductor Applications,” Automotive Power Electronics 1989, pp. 89 - 97.

    Google Scholar 

  19. Method for Power Electronic Devices Thermal Characterization — Part I: Fundamentals and Theory, IEEE Transactions on Power Electronics, Vol. 13, No. 6, November 1998, pp. 1208 - 1219.

    Article  Google Scholar 

  20. P.E. Bagnoli, C. Casarosa, M. Ciampi, E. Dallago, “Thermal Resistance Analysis by Induced Transient (TRAIT) Method for Power Electronic Devices Thermal Characterization — Part H: Practice and Experiments,” IEEE Transactions on Power Electronics,Vol. 13, No. 6, November 1998, pp. 1220-1228.

    Google Scholar 

  21. F.N. Masana, “A New Approach to the Dynamic Thermal Modelling of Semiconductor Packages,” Microelectronics Reliability 41 (2001) 901 - 912.

    Article  Google Scholar 

  22. G.T. Temes, J.W. LaPatra, “Introduction to Circuit Synthesis and Design, ”Mc GrawHill, 1977.

    Google Scholar 

  23. R.E. Thomas, A.J. Rosa, “Circuits and Signals: An Introduction to Linear and Interface Circuits,” John Wiley & Sons.

    Google Scholar 

  24. P. Antognetti, G. R. Bisio, F. Curatelli, S. Palara, “Three-Dimensional Transient Thermal Simulation: Application to Delayed Short Circuit Protection in Power ICs,” IEEE Journal of Solid-State Circuits, Vol. sc-15, No. 3, June 1980, pp. 277 - 280.

    Google Scholar 

  25. H.S. Carslaw, J.C. Jaeger, “Conduction of Heat in Solids,” Oxford Science Publications, 1959.

    Google Scholar 

  26. S. Nishino, K. Ahshima, “A study on fault detection for MSULSI Board by Thermography,” Proc. of Pacific Rim International Symposium on Fault Tolerant Computing, Melbourne, Australia, pp. 198 - 202, Dec. 1993.

    Google Scholar 

  27. S. Nishino, K. Ahshima, “VLSI PCB Fault Detection Ability Using Thermography,” The Bulletin of the Oyama National College of Technology, No. 27, March 1995.

    Google Scholar 

  28. J. Kölzer, J. Otto, “Electrical Characterization of Megabit DRAMs, Part2: Internal Testing” IEEE Design & Test of Computers, pp. 39 - 51, December 1991.

    Google Scholar 

  29. J. Altet, “Thermal coupling in mixed circuits: Application to the Test of Integrated Circuits,” Ph.D. Thesis. Electronic Engineering Department. Universitat Politècnica de Catalunya, Barcelona, Spain. 1997. ISBN: 84-7653-726-3.

    Google Scholar 

  30. J. Altet, A. Rubio, “Built-in dynamic thermal testing technique for ICs,” Electronics Letters. Vol. 32, No. 21, pp. 1982-1984, 10`h October 1996.

    Google Scholar 

  31. J. Altet, A. Rubio, “An Approach to On Line Differential Thermal Testing,” Proc. 2nd IEEE International On-Line Testing Workshop IOTW96. 1996. pp. 17 - 20.

    Google Scholar 

  32. J. Altet, A. Rubio, W. Claeys, S. Dilhaire, E. Schaub, H. Tamamoto, “Differential thermal testing: an approach to its feasibility”, Journal of Electronic Testing: Theory and Applications 14, 57 - 66, 1999.

    Article  Google Scholar 

  33. S. Lopez-Buedo, J. Garrido, E. Boemo, “Thermal testing on Reconfigurable Computers”, IEEE Design & Test of Computers. Vol. 17. No. 1, pp. 84 - 91. January-March 2000.

    Google Scholar 

  34. J Altet, A. Rubio, E. Schaub, S. Dilhaire, W. Claeys, “Thermal Couplings in Integrated Circuits: Application to Thermal Testing,”IEEE Journal of Solid-State Circuits,Vol. 36, No. 1, Jan 2001, pp. 81-91.

    Google Scholar 

  35. A. Rubio, J. Figueras, R. Rodriguez, J. Segura, “Iddq Secondary Components in CMOS Logic Circuits Preceded by Defective Stages Affected by Analogue Type Faults,” IEE Electronics Letters, 29th August 1991, Vol. 27, No. 18, pp. 1656 - 1658.

    Google Scholar 

  36. S. Dilhaire, J. Altet, S. Jorez, E. Schaub, A. Rubio, W. Claeys, “Fault localization in Ics by goniometric laser probing of thermal induced surface waves”, Microelectronics Reliability 39, pp. 919 - 923. 1999.

    Article  Google Scholar 

  37. S. Dilhaire, E. Schaub, W.Claeys, J. Altet, A. Rubio, “Localisation of heat sources in electronic circuits by microthermal laser probing”, Int. Journal Thermal Sciences, No. 39, 2000, pp. 544 - 549.

    Article  Google Scholar 

  38. J. Altet, A. Rubio, S. Dilhaire, E. Schaub, W. Claeys, “Thermal Testing, Application to IC Diagnosis”, 18th VLSI Test Symposium, VTS’00, 2000, pp. 189 - 193.

    Google Scholar 

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Authors and Affiliations

  1. University Politècnia de Catalunya, Spain

    Josep Altet & Antonio Rubio

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  1. Josep Altet
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  2. Antonio Rubio
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© 2002 Springer Science+Business Media Dordrecht

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Altet, J., Rubio, A. (2002). Temperature as a test observable variable in ICs. In: Thermal Testing of Integrated Circuits. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-3635-9_4

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  • DOI: https://doi.org/10.1007/978-1-4757-3635-9_4

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4419-5287-5

  • Online ISBN: 978-1-4757-3635-9

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