Modeling and Characterization of IC Interconnects and Packagings for the Signal Integrity Verification of High-Performance VLSI Circuits

  • Yungseon Eo
Part of the Network Theory and Applications book series (NETA, volume 8)


Today’s state of the art VLSI circuits, microwave integrated circuits, and next generation VLSI or ULSI circuit designs face new challenging problems, that is, signal integrity problems. With the advent of deep submicron semiconductor processing technology, there has been rapid development of IC with integration of more than several hundred million transistors. These VLSI circuits will be operated with clock frequencies greater than several GHz. However, such an increase of integration level and speed raises the risk of poor noise margins and timing malfunctions during circuit operations. Therefore, when designing high performance VLSI circuits, very accurate design methodologies are required.


Transmission Line VLSI Circuit Spice Simulation Crosstalk Noise Switching Gate 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer Science+Business Media Dordrecht 2001

Authors and Affiliations

  • Yungseon Eo
    • 1
  1. 1.Department of Electrical and Computer EngineeringHanyang UniversityAnsan, Kyungki-DoSouth Korea

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