Abstract
Constituive behaviour and fracture of micro solder joints are supposed to differ very much from that of bulky samples. The paper presents the results of reversible shear tests on flip chip solder joints under isothermal conditions. Two micro shear testers have been designed and built for this task. One tester is optimized to achieve high precision. The second tester works very similar but fits in a UHV chamber. This way, it enables in-situ SEM observations during the test. The experimental program included cyclic shear tests for elastic plastic material data as well as a new reversal creep and relaxation test procedure for time dependent deformation data. FEM simulation has subsequently been applied to evaluate the experimental raw data to extract material parameters according to the material models provided by ANSYS ®. Crack propagation was investigated by isothermal mechanical cycling.
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Wiese, S., Feustel, F., Meusel, E. (2000). Solder Material Characterisation and Modelling. In: Zhang, G.Q., Ernst, L.J., de Saint Leger, O. (eds) Benefiting from Thermal and Mechanical Simulation in Micro-Electronics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-3159-0_3
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DOI: https://doi.org/10.1007/978-1-4757-3159-0_3
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