Solder Material Characterisation and Modelling

  • Steffen Wiese
  • Frank Feustel
  • Ekkehard Meusel


Constituive behaviour and fracture of micro solder joints are supposed to differ very much from that of bulky samples. The paper presents the results of reversible shear tests on flip chip solder joints under isothermal conditions. Two micro shear testers have been designed and built for this task. One tester is optimized to achieve high precision. The second tester works very similar but fits in a UHV chamber. This way, it enables in-situ SEM observations during the test. The experimental program included cyclic shear tests for elastic plastic material data as well as a new reversal creep and relaxation test procedure for time dependent deformation data. FEM simulation has subsequently been applied to evaluate the experimental raw data to extract material parameters according to the material models provided by ANSYS ®. Crack propagation was investigated by isothermal mechanical cycling.


Solder Joint Crack Growth Rate Steady State Creep Shear Angle Flip Chip 
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  1. 1.
    Rzepka, S.; Meusel, E.: Flip Chips directly attached to FR4 Printed Circuit Boards: FEM Simulations and Experimental Tests, Proc. ITAP(1995),San Jose, pp. 8–15Google Scholar
  2. 2.
    Auersperg, J.; Schubert, A.; Vogel, D.; Michel, B.; Reichl, H.: Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC. Pro-ceedings of the Symposium on Application of Fracture Mechanics in Electronic Packaging at the 1997 ASME International Engineering Congress and Exhibition, Dallas, Nov. 16–21, 1997, AMD-Bd. 222/EEP-Bd. 20, S. 133–138Google Scholar
  3. 3.
    Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H.: An Efficient Approach to Predict Solder Fatigue Life and its Application to SM- and Area Array Components. Proceedings IEEE 47th Electronic Components and Technology Conference, 1997, S. 462–471Google Scholar
  4. 4.
    Jendrny, J.; Müller, W.H.; Albrecht, H.-J.: Models and Concepts for Lifetime Prediction of SMT Solder Joints: A Comparison and Critical Evaluation. Proceedings of the Micro Materials ‘87 Conference, Berlin, ddp Goldenbogen 1997, S. 907–912Google Scholar
  5. 5.
    Feustel, F.; Meusel, E.:“ Modellierung und Simulation von Einbaufällen”. In: Direktmontage–Handbuch über die Verarbeitung ungehäuster IC’s. Reichl, H. (Ed.). Berlin–Heidelberg–New York: Springer 1998, S. 255–261Google Scholar
  6. 6.
    Rzepka, S.; Feustel, F.; Meusel, E.: The Effect of Underfill Imperfections on the Reliability of Flip Chip Modules: FEM Simulations and Experiments, Proceedings IEEE 50th Electronic Components and Technology Conference, 25–28. 05. 1998, S. 362–370Google Scholar
  7. 7.
    Schubert, A.; Dudek, R.; Kloeser, J., Michel, B.; Reichel, H.; Hauck, T.; Kaskoun, K.: Experimental and Numerical Reliability Investigations of FCOB Assembblies with Process-induced Defects, Proceedings IEEE 50th Electronic Components and Technology Conference, 21–25. 05. 2000, S. 624–632Google Scholar
  8. 8.
    Feustel, F.; S.Wiese, S.; Meusel, E.: Time-Dependent Material Modeling for Finite Element Analyses of Flip Chips, Proceedings IEEE 50th Electronic Components and Technology Conference, 21–25. 05. 2000, S. 1548–1553Google Scholar
  9. 9.
    Wiese, S.; Feustel, F.; Rzepka, S.; Meusel, E.: Creep and Crack Propagation in Flip Chip SnPb37 Solder Joints, Proceedings IEEE 49th Electronic Components and Technology Conference, 01–04. 06. 1999, S. 1015–1020Google Scholar
  10. 10.
    Z. Guo; H. Conrad: Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints, Trans. of the ASME Journal of Electronic Packaging, June 1993, Vol. 115, p. 159–164CrossRefGoogle Scholar
  11. 11.
    Wiese, S., Feustel, F., Rzepka, S., Meusel, E.: Crack propagation experiments on flip chip solder joints. Electronic Packaging Materials Science X - MRS Symposium Proceedings, April 14–16, 1998, San Francisco, Belton, D. J., Gaynes, M., Jacobs, E. G., Pearson, R., Wu, T. (Ed.), Materials Research Society, Warrendale, Vol. 515 (1998), pp. 227–232Google Scholar

Copyright information

© Springer Science+Business Media Dordrecht 2000

Authors and Affiliations

  • Steffen Wiese
    • 1
  • Frank Feustel
    • 1
  • Ekkehard Meusel
    • 1
  1. 1.Institut f. Halbleiter- und MikrosystemtechnikTechnische Universität DresdenGermany

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