Abstract
This chapter contains an exhaustive attempt to reveal the elementary characteristics of substrate coupling. The aim of this part is to determine how coupling is affected by factors such as the type of wafer, the type of coupled devices, the biasing of these devices, and layout and technology parameters.
The chapter starts with a description of the mechanisms by which circuit nodes interact with the substrate. Next, the way device characteristics layout and technology parameters, device type and biasing- affect coupling is studied with device simulations and experimental measurements. Lastly, we analyze the way noise propagation is affected by the substrate type or particular biasing, assuming ideal grounding conditions. In following chapters the consequences of non-ideal supplies on the results obtained will be analyzed.
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Aragonès, X., González, J.L., Rubio, A. (1999). Substrate noise characteristics and propagation. In: Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-3013-5_2
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DOI: https://doi.org/10.1007/978-1-4757-3013-5_2
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