Three basic topics should be addressed for the design of RFICs targeting a specific system application: 1) transceiver architecture for Eoptimum system and chip partitioning as well as optimum use of sortware techniques, 2) semiconductor technology for optimum performance, cost and integration path, 3) circuit implementation. At this point in time, there is no practical universal RF IC transceiver architecture based on only one technology that can satisfy any system requirement. Every application has its own set of solutions (and some time several sets of solutions), but it is not inconceivable that “programmable” mobile radio transceivers serving multistandard applications will emerge in the next few years.
This paper addresses some of these issues and presents results that illustrate the trends and options in developing RF IC components for wireless commuications.
KeywordsNoise Floor Transceiver Architecture GaAs MESFET Cordless Telephone Specific System Application
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- J. Sevenhans, et.al, “An Analog Radio Front-End Chipset for 1.9ghz Mobile Radio TelephoneApplications, International Solid-State Cicuits Conference, San Francisco, 1994, pp. 44–45Google Scholar
- Baines, R., “The DSP Bottleneck,” IEEE Communications magazine, (vol. 33) no. 5 May, 1995, pp. 46–53Google Scholar
- Murden, F.; and Gosser, R., “12b 50 MSample/s Two-Stage A/D Converter,” IEEE Solid-State Circuits conference, Feb., 1995, pp. 278–279Google Scholar
- Jantzi, S.A.; Snelgrove, W.M.; Ferguson, P.F., Jr., “A Fourth-Order Bandpass SigmaDelta Modulator,” IEEE Journal of Solid-State Circuits, March, 1993, Vol. 28, (No. 3) pp. 282–91Google Scholar
- K. fie, et al, “A 2.7V GSM RF Transceiver IC,” ISSCC Digest,pp302–303Google Scholar
- JC Rudell,et al, “A 1.9Ghz Wide-Band Double Conversion CMOS IC for Cordless Telephone Applications,” ISSCC Digest, 1997, pp 304.Google Scholar