Skip to main content

Capacitive Interfaces for Monolithic Integrated Sensors

  • Chapter
Analog Circuit Design

Abstract

Surface micromachining has become an established technology for inertial sensing. Compatibility with standard IC fabrication processes enables monolithic integration of the sensing element and interface electronics for reduced size and power dissipation, simplified packaging, and increased functionality. The need to resolve sub-Angstrom displacements poses a challenge on the interface. Capacitive pickups are attractive since they do not require special processing and because of their dual function as sensor and electrostatic actuator. The principles and practical considerations for capacitive sensor interfaces are discussed along with circuit examples including a precision sensor with a 3×10-12m/rt-Hz position measurement noise floor.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 129.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. J. M. Bustillo, G. K. Fedder, C. T.-C. Nguyen, and R. T. Howe, “Process technology for the modular integration of CMOS and polysilicon microstructures,” Microsystem Technologies, vol. 1, pp. 30–41 1994.

    Article  Google Scholar 

  2. T. A. Core, W. K. Tsang, and S. J. Sherman, “Fabrication technology for an integrated surface-micromachined sensor,” Solid State Technol. , vol. 36, no. 10, pp. 39–40, 42, 44, 46–37, Oct. 1993.

    Google Scholar 

  3. J. H. Smith, S. Montague, J. J. Sniegowski, J. R. Murray, and P. J. McWhorter, “Embedded micromechanical devices for the monolithic integration of MEMS with CMOS,” in IEDM Tech. Dig., 1995, pp. 609–612.

    Google Scholar 

  4. ADXL50, “Monolithic accelerometer with signal conditioning.” Datasheet, Analog Devices, Inc, One Technology Way, Norwood, MA 02062, 1993.

    Google Scholar 

  5. ADXL05, “Monolithic accelerometer with signal conditioning.” Datasheet, Analog Devices, Inc., One Technology Way, Norwood, MA 02062, 1995.

    Google Scholar 

  6. MMAS40, “Micromachined accelerometer.” Datasheet, Motorola, Inc, Motorola Literature Distribution, P.O.Box 20912, Phoenix, AZ 85036, 1995.

    Google Scholar 

  7. M. A. Lemkin, M. A. Oritiz, N. Wongkomet, B. E. Boser, and J. H. Smith, “A 3-axis surface micromachined ΣΔ accelerometer,” in ISSCC Dig. Tech. Papers, 1997, pp. 202–203.

    Google Scholar 

  8. G. K. Fedder, S. Santhanam, M. L. Reed, S. C. Eagle, D. F. Guillou, M. S. C. Lu, and L. R. Carley, “Laminated high-aspect-ratio microstructures in a conventional CMOS process,” in Proceedings. IEEE, The Ninth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems, 1996, pp. 13–18.

    Google Scholar 

  9. T. J. Brosnihan, A. P. Pisano, and R. T. Howe, “Surface micromachined angular accelerometer with force-feedback.,” in Dig. ASME Int. Conf. and Exp., 1995

    Google Scholar 

  10. M. A. Lemkin, “A fully differential lateral ΣΔ accelerometer with drift cancellation circuitry,” in Technical Digest Solid-State Sensor and Actuator Workshop, 1996, pp. 90–93.

    Google Scholar 

  11. W. Yun, R. T. Howe, and P. R. Gray, “Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry,” in Technical Digest. IEEE Solid-State Sensor and Actuator Workshop, 1992, pp. 126–131.

    Google Scholar 

  12. M. Lemkin and B. E. Boser, “A micromachined fully differential lateral accelerometer,” in Proc. IEEE Custom Integrated Circuits Conf, 1996, pp. 315–318.

    Chapter  Google Scholar 

  13. T. B. Gabrielson, “Mechanical-thermal noise in micromachined acoustic and vibration sensors,” IEEE Trans. Electron Dev., vol. 40, no. 5, pp. 903–909, May 1993.

    Article  Google Scholar 

  14. B. E. Boser and R. T. Howe, “Surface micromachined accelerometers,” IEEE J. Solid-State Circuits, vol. 31, no. 3, pp. 366–375, May 1996.

    Article  Google Scholar 

  15. R. T. Howe, B. E. Boser, and A. P. Pisano, “Polysilicon integrated microsystems: technologies and applications,” Sens. Actuators A, Phys., vol. A56, no. 1–2, pp. 167–177, Aug. 1996.

    Article  Google Scholar 

  16. C. Lu, M. Lemkin, and B. E. Boser, “A monolithic surface micromachined accelerometer with digital output,” IEEE J. Solid-State Circuits, vol. 30, no. 12, pp. 1367–1373, Dec. 1995.

    Article  Google Scholar 

  17. J. C. Candy and G. C. Temes, “Oversampling methods for A/D and D/A conversion,” in Oversampling delta-sigma data converters, no. Issue, J. C. Candy and G. C. Termes, Eds.: IEEE Press, 1992, pp. 1–29.

    Google Scholar 

  18. W. Henrion, L. DiSanza, M. Ip, S. Terry, and H. Jerman, “Wide dynamic range direct digital accelerometer,” in Tech. Dig. Solid-State Sensor and Actuator Workshop, 1990.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 1997 Springer Science+Business Media Dordrecht

About this chapter

Cite this chapter

Boser, B.E. (1997). Capacitive Interfaces for Monolithic Integrated Sensors. In: van de Plassche, R.J., Huijsing, H.H., Sansen, W. (eds) Analog Circuit Design. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-2602-2_9

Download citation

  • DOI: https://doi.org/10.1007/978-1-4757-2602-2_9

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4419-5185-4

  • Online ISBN: 978-1-4757-2602-2

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics