Integrated Sensor Systems in CMOS Technology

  • Bedrich J. Hosticka

Abstract

In this contribution we discuss the tundamental issues ot designing and building integrated sensor systems in CMOS technology.

Keywords

Sensor System CMOS Technology Correlate Double Sampling Compensation Coil Sensor Signal Processing 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. [1]
    H. Komiya, “Future technological and economic prospects for VLSI”, Digest of Techn. Papers IEEE Int. Solid-State Circ. Conf. (ISSCC ‘93), San Francisco (Cal.), pp. 16–19, Febr. 1993.Google Scholar
  2. [2]
    B. J. Hosticka, “Circuit and system design for silicon microsensors”, Proc. IEEE Int. Symp. on Circuits and Systems (ISCAS ‘92), San Diego (Cal.), vol. 4, pp. 1824–1827, Mai 1992.Google Scholar
  3. [3]
    K. D. Wise, “Micromechanical systems: Interfacing electronics to a non-electronic world”, Digest of Techn. Papers IEEE Int. Electron Devices Meeting (IEDM ‘96), San Francisco (Cal.), pp. 11–18, Dec. 1996.CrossRefGoogle Scholar
  4. [4]
    H. Baltes, O. Paul, J. G. Korvinck, M. Schneider, J. Bühler, N. Scheeberger, D. Jaeggi, P. Malcovati, M. Hornung, A. Häberli, M. von Arx, F. Mayer, and J. Funk, “IC MEMS transducers”, Digest of Techn. Papers IEEE Int. Electron Devices Meeting (IEDM ‘96), San Francisco (Cal.), pp. 521–524, Dec. 1996Google Scholar
  5. [5]
    M. Schanz, W. Brockherde, B.J. Hosticka, and R. Klinke, “A CMOS linear image sensor array with on-chip programmable signal processing”, Proc. 21st European Solid-State Circuits Conference (ESSCIRC ‘95), Lille (France), pp. 242–245, Sept. 1995.Google Scholar
  6. [6]
    R. Hauschild, B. J. Hosticka, S. Müller, and M. Schwarz, “A CMOS optical sensor system performing image sampling on a hexagonal grid”, Proc. 22nd European Solid-State Circuits Conference (ESSCIRC’96), Neuchâtel (Switzerland), pp. 304–307, Sept. 1996.Google Scholar
  7. [7]
    S. Ulbricht, W. Budde, R. Gottfried-Gottfried, R. Jähne, B. Sauer, and U. Wende, “A mono-lithically integrated two-axis magnetic field sensor system”, Proc. 22nd European Solid-State Circuits Conference (ESSCIRC’96), Neuchâtel (Switzerland), pp. 132–135, Sept. 1996.Google Scholar
  8. [8]
    R. Jähne, W. Budde, R. Gottfried-Gottfried, H. Kück, and M. Müller, “Monolithic infrared sensor system with programmable readout electronics”, Proc. 20th European Solid-State Circuits Conference (ESSCIRC ‘94), Ulm (Germany), pp. 292–295, Sept. 1994.Google Scholar
  9. [9]
    U. Schöneberg, H. G. Dura, B. J. Hosticka, and W. Mokwa, “Low-drift gas sensor with on-chip instrumentation”, Dig. of. Techn. Papers IEEE Int. Conf. on Solid-State Sensors and Actuators (TRANSDUCERs 91), San Francisco (Cal.), pp. 1006–1007, June 1991.Google Scholar
  10. [10]
    W. Mokwa, “Silicon technologies for sensor fabrication”, in Chemical Sensor Technology (Ed. S. Yamauchi), vol. 4, pp. 43–62, Kodansha Ltd. , Tokyo (Japan), 1992.Google Scholar
  11. [11]
    O. Machul, D. Hammerschmidt, W. Brockherde, B. J. Hosticka, E. Obermeier, and P. Krause, “A smart pressure transducer with on-chip readout, calibration and nonlinear temperature compensation based on spline-functions”, Digest of Techn. Papers IEEE Int. Solid-State Circ. Conf. (ISSCC ‘97), San Francisco (Cal.), pp. 198–199, Febr. 1997.Google Scholar
  12. [12]
    R. S. Payne, S. Sherman, S. Lewis, and R. T. Howe, “Surface micromachining: From vision to reality to vision”, Digest of Techn. Papers IEEE Int. Solid-State Circ. Conf. (ISSCC ‘95), San Francisco (Cal.), pp. 164–165, Febr. 1995.Google Scholar

Copyright information

© Springer Science+Business Media Dordrecht 1997

Authors and Affiliations

  • Bedrich J. Hosticka
    • 1
  1. 1.Fraunhofer Institute of Microelectronic Circuits and SystemsDuisburgGermany

Personalised recommendations