Modeling of Transient Heating in Smart Power Applications

Abstract

Economic forces and integrated product designs are forcing the fabrication of some smart power applications on smaller die and on alternative substrates. This results in greater heating for a given application. Thermal models of possible advanced versions of an automotive fuel injector application suggest that while steady state heating is acceptable in these designs, transient heating may become a concern. The peak transient temperature in a 50% shrink of the injector application would be close to the empirical safe design limit, while a reduced device on bonded wafers is predicted to exceed the limit. This requires consideration of innovative energy management strategies and careful reliability assessment.