Abstract
Although most types of devices can be fabricated in SOI films, the preferred application field for Silicon-on-Insulator technology is undeniably CMOS. Other types of devices (bipolar devices, COMFETs, novel devices) will be reviewed in Chapter 6. SOI MOSFETs exhibit interesting properties which make them particularly attractive for applications such as rad-hard circuits, deep-submicron devices and high-temperature electronics. The properties of the SOI MOSFET operating in a harsh environment will be described in Chapter 7.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Bibliography
D. Flandre and F. Van de Wiele, Proc. of the IEEE SOS/SOI Technology Conference, p. 27, 1989
N.J. Thomas and J.R. Davis, Proc. of the IEEE SOS/SOI Technology Conference, p. 130, 1989
see, for example, S.M. Sze, Physics of Semiconductor Devices 2nd Ed., New York: J. Wiley and Sons, 1981
H.K. Lim and J.G. Fossum, IEEE Trans. on Electron Devices, Vol. 30, p. 1244, 1983
J.P. Colinge, IEEE Electron Device Lett., Vol. 6, p. 573, 1985
R.S. Muller and T.I. Kamins, Device Electronics for Integrated Circuits, J. Wiley and Sons, p. 436, 1986
J. Witfield and S. Thomas, IEEE Electron Dev. Lett., Vol. 7, p. 347, 1986
J.P. Colinge, Microelectronic Engineering, Vol. 8, p. 127, 1988
R.S. Muller and T.I. Kamins, Device Electronics for Integrated Circuits J. Wiley and Sons, p. 487, 1986
S.Veeraraghavan and J.G. Fossum, IEEE Trans. on Electron Devices, Vol. 35, p. 1866, 1988
T.W. MacElwee and D.I. Calder, Proceedings of the second international Symposium on Ultra Large Scale Integration Science and Technology, Ed. by C.M. Osbum and J.M. Andrews, Vol. 89–9, The Electrochemical Society, p. 693, 1989, and T.W. MacElwee and I.D. Calder, Proceedings IEEE SOS/SOI Technology Conference, p. 171, 1989
J.P. Colinge, Techn. Digest of International Electron Devices Meeting (IEDM), p. 817, 1989
J.G. Fossum, Proceedings of the fourth international Symposium on Siliconon-Insulator Technology and Devices, ed. by D.N. Schmidt, Vol. 90–6, The Electrochemical Society, p. 491, 1990
T. Sekigawa and Y. Hayashi, Solid-State Electron., Vol. 27, pp. 827, 1984
D. Hisamoto, T. Kaga, Y. Kawamoto, and E. Takeda, Techn. Digest of International Electron Devices Meeting (IEDM), p. 833, 1989
S.Veeraraghavan and J.G. Fossum, IEEE Trans. on Electron Devices, Vol. 36, p. 522, 1989
H.K. Lim and J.G. Fossum, IEEE Trans. on Electron Devices, Vol. 31, p. 401, 1984
H.K. Lim and J.G. Fossum, IEEE Trans.Techn. Digest of IEEE Internat. Electron Device Meeting (IEDM),Dutartre, in “Silicon-On-Insulator and Buried Metals in Semiconductors”, Sturm, Chen, Pfeiffer and Hemment Eds., (North-Holland), MRS Symposium Proceedings, Vol. 107, p. 157, 1988, and D. Dutartre, M. Haond, and D. Bensahel“Semiconductor-On-Insulator and Thin Film Transistor Technology”, Chiang, Geis and Pfeiffer Eds., (North-Holland), MRS Symposium Proceedings, Vol. 53 on Electron Devices, Vol. 32, p. 446, 1985
R.J. Van Overstraeten, G.J. Declerck, and P.A. Muls, IEEE Trans. Electron Devices, Vol. ED-20, p. 1150, 1973, and S.M. Sze, Physics of Semiconductor Devices, Wiley and Sons, p. 446, 1981
D.J. Wouters, J.P. Colinge, and H.E. Maes, IEEE Trans. Electron Devices, Vol. ED-37, p. 2022, 1990
J.P. Colinge, IEEE Electron Device Leti.,Techn. Digest of IEEE Internat. Electron Device Meeting (IEDM),Dutartre, in “Silicon-On-Insulator and Buried Metals in Semiconductors”, Sturm, Chen, Pfeiffer and Hemment Eds., (North-Holland), MRS Symposium Proceedings, Vol. 107, p. 157, 1988, and D. Dutartre, M. Haond, and D. Bensahel“Semiconductor-On-Insulator and Thin Film Transistor Technology”, Chiang, Geis and Pfeiffer Eds., (North-Holland), MRS Symposium Proceedings, Vol. 53 Vol. EDL-7, p. 244, 1986
J.P. Cotinge, Ext. Abstracts of 5th Internat. Workshop on Future Electron Devices, Miyagi-Zao, Japan, p. 105, 1988
K.Asada, H. Miki, M. Kumon, and T. Sugano, Ext. Abstracts of 8th Internat. Workshop on Future Electron Devices, Kochi, Japan, p. 165, 1990
S.C. Sun and J.D. Plummer, IEEE Trans. on Electron Devices, Vol. 27, pp. 1497, 1980
M. Yoshimi, H. Hazama, M. Takahashi, S. Kambayashi, T. Wada, K. Kato, and H. Tango, IEEE Trans. on Electron Devices, Vol. 36, pp. 493, 1989
A. Yoshino, Proceedings of the fourth international Symposium on Siliconon-Insulator Technology and Devices, ed. by D.N. Schmidt, Vol. 90–6, The Electrochemical Society, p. 544, 1990
F. Balestra, S. Cristoloveanu, M. Benachir, J. Brini, and T. Elewa, IEEE Electron Device Lett., Vol. 8, pp. 410, 1987
J.C. Sturm, Silicon-on-Insulator and Buried Metals in Semiconductors, MRS Symp. Proc., Ed. by J.C. Sturm, C.K. Chen, L. Pfeiffer, and P.L.F. Hemment, Vol.107, p. 295, 1988,and J.C. Sturm, K. Tokunaga, and J.P. Colinge, IEEE Electron Device Letters, Vol. 9, p. 460, 1988
J.C. Sturm and K. Tokunaga, Electronics Letters,Techn. Digest of IEEE Internat. Electron Device Meeting (IEDM),Dutartre, in “Silicon-On-Insulator and Buried Metals in Semiconductors”, Sturm, Chen, Pfeiffer and Hemment Eds., (North-Holland), MRS Symposium Proceedings, Vol. 107, p. 157, 1988, and D. Dutartre, M. Haond, and D. Bensahel“Semiconductor-On-Insulator and Thin Film Transistor Technology”, Chiang, Geis and Pfeiffer Eds., (North-Holland), MRS Symposium Proceedings, Vol. 53 Vol. 25, p. 1233, 1989
J.G. Fossum, J.Y. Choi, and R. Sundaresan, IEEE Trans. on Electron Devices, Vol. 37, p. 724, 1990
P. Antognetti and G. Massobrio, Semiconductor Device Modeling with Spice, McGraw-Hill, p. 185, 1988
B. Dierickx, L. Warmerdam, E. Simoen, J. Vermeiren, and C. Claeys, IEEE Trans. on Electron Devices, Vol. 35, p. 1120, 1988
J. Tihanyi and H Schlötterer, IEEE Trans. on. Electron Devices, Vol. 22, p. 1017, 1975
G. Merckel, Nato Course on Process and Device Modeling for Integrated Circuit Design, Ed. by F. Van de Wiele, W. Engl and P. Jespers, Groningen, The Netherlands, Noordhoff, p. 725, 1977
J.P. Colinge, IEEE Electron Device Lett., Vol. 9, p. 97, 1988
K.M. Cham, S.Y. Oh, D. Chin, and J.L. Moll, Computer Aided Design and VLSI Device Development, Hingham, MA, Kluwer Academic Publishers, p. 240, 1986
P.K. Ko, S. Tam, C. Hu, S.S. Wong, and C.G. Sodini, Techn. Digest of International Electron Devices Meeting (IEDM), p. 88, 1984
C. Hu, Techn. Digest of International Electron Devices Meeting (IEDM), p. 176, 1983
C.Hu, S.C. Tam, F.C. Hsu, P.K. Ko, T.Y. Chan, and T.W. Terrill, IEEE Trans. on. Electron Devices, Vol. 32, p. 375, 1985
J.P. Colinge, IEEE Trans. on Electron Devices, Vol. 34, p. 2173, 1987
J.R. Davis, A.E. Glaccum, K. Reeson, and P.L.F. Hemment, IEEE Electron Device Letters, Vol. 7, p. 570, 1986
J.Y. Choi and J.G. Fossum, Proceedings IEEE SOS/SOI Technology Conference, p. 21, 1990
C.E.D. Chen, M. Matloubian, R. Sundaresan, B.Y. Mao, C.C. Wei, and G.P. Pollack, IEEE Electron Device Letters, Vol. 9, p. 636, 1988
R. Sundaresan and C.E.D. Chen, Proceedings of the fourth international Symposium on Silicon-on-Insulator Technology and Devices, ed. by D.N. Schmidt, Vol. 90–6, The Electrochemical Society,Meth. in Phys. Research,Techn. Digest of IEEE Internat. Electron Device Meeting (IEDM),Dutartre, in “Silicon-On-Insulator and Buried Metals in Semiconductors”, Sturm, Chen, Pfeiffer and Hemment Eds., (North-Holland), MRS Symposium Proceedings, Vol. 107, p. 157, 1988, and D. Dutartre, M. Haond, and D. Bensahel“Semiconductor-On-Insulator and Thin Film Transistor Technology”, Chiang, Geis and Pfeiffer Eds., (North-Holland), MRS Symposium Proceeding p. 455, 1990
A.J. Auberton-Hervé, Proceedings of the fourth international Symposium on Silicon-on-Insulator Technology and Devices, ed. by D.N. Schmidt, Vol. 90–6, The Electrochemical Society, p. 544, 1990
H.S. Sheng, S.S. Li, R.M. Fox, and W.S. Krull, IEEE Trans. on Electron Devices, Vol. 36, no. 3, p. 488, 1989
Grove, A.S., Physics and Technology of Semiconductor Devices, J. Wiley and Sons, pp. 230, 1967
M. Haond and J.P. Colinge, Electronics Letters, Vol. 25, p. 1640, 1989
K.K. Young and J.A. Burns, IEEE Transactions on Electron Devices, Vol. 35,Meth. in Phys. Research,Techn. Digest of IEEE Internat. Electron Device Meeting (IEDM),Dutartre, in “Silicon-On-Insulator and Buried Metals in Semiconductors”, Sturm, Chen, Pfeiffer and Hemment Eds., (North-Holland), MRS Symposium Proceedings, Vol. 107, p. 157, 1988, and D. Dutartre, M. Haond, and D. Bensahel“Semiconductor-On-Insulator and Thin Film Transistor Technology”, Chiang, Geis and Pfeiffer Eds., (North-Holland), MRS Symposium Proceeding p. 426, 1988
J.P. Colinge, IEEE Trans. on Electron Devices, Vol. 37, p. 718, 1990
D.P. Vu, A. Chantre, D. Ronzani, and J.C. Pfister, in “Semiconductor-On-Insulator and Thin Film Transistor Technology”, Chiang, Geis and Pfeiffer Eds., (North-Holland), MRS Symposium Proceedings, Vol. 53, p. 357, 1986
Grove, A.S., Physics and Technology of Semiconductor Devices, J. Wiley and Sons,Meth. in Phys. Research,Techn. Digest of IEEE Internat. Electron Device Meeting (IEDM),Dutartre, in “Silicon-On-Insulator and Buried Metals in Semiconductors”, Sturm, Chen, Pfeiffer and Hemment Eds., (North-Holland), MRS Symposium Proceedings, Vol. 107, p. 157, 1988, and D. Dutartre, M. Haond, and D. Bensahel“Semiconductor-On-Insulator and Thin Film Transistor Technology”, Chiang, Geis and Pfeiffer Eds., (North-Holland), MRS Symposium Proceeding pp. 326, 1967
J.G. Fossum, R. Sundaresan, and M. Matloubian, IEEE Transactions on Electron Devices, Vol. 8, p. 544, 1987
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 1991 Springer Science+Business Media New York
About this chapter
Cite this chapter
Colinge, JP. (1991). The SOI MOSFET. In: Silicon-on-Insulator Technology. The Springer International Series in Engineering and Computer Science, vol 132. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-2121-8_5
Download citation
DOI: https://doi.org/10.1007/978-1-4757-2121-8_5
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4757-2123-2
Online ISBN: 978-1-4757-2121-8
eBook Packages: Springer Book Archive