Abstract
The reliability of BiCMOS process is a key issue in establishing its viability. Some concerns have been raised regarding the increased process complexity and the compatibility of fabricating CMOS and bipolar devices on the same chip. Performance and process tradeoffs are expected as these two device types are merged with minimal additional process steps. Therefore, it is imperative that device reliability issues are integrated with the process architecture and device design issues.
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Lahri, R., Joshi, S.P., Bastani, B. (1990). Process Reliability. In: Alvarez, A.R. (eds) BiCMOS Technology and Applications. The Springer International Series in Engineering and Computer Science, vol 76. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-2029-7_4
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DOI: https://doi.org/10.1007/978-1-4757-2029-7_4
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