Skip to main content

Abstract

This chapter describes the fault analysis phase of yield simulation. Once defects have been sized and placed on the chip layout, they must be examined to determine what circuit faults, if any, have occurred. Techniques for performing this analysis include local circuit extraction, layer combination analysis, and type-driven analysis. All of the fault analysis methods described here assume that the input layout geometry has been preprocessed to simplify analysis. We begin this chapter by describing this preprocessing phase. We then briefly describing the local circuit extraction and layer combination analysis methods and showing why they are not suitable for our purposes because of poor performance. We then describe the type-driven analysis method which is best suited for our purpose, and used in VLASIC.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 129.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

Copyright information

© 1987 Springer Science+Business Media Dordrecht

About this chapter

Cite this chapter

Walker, D.M.H. (1987). Fault Analysis. In: Yield Simulation for Integrated Circuits. The Springer International Series in Engineering and Computer Science, vol 33. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-1931-4_5

Download citation

  • DOI: https://doi.org/10.1007/978-1-4757-1931-4_5

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4419-5201-1

  • Online ISBN: 978-1-4757-1931-4

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics