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Nondestructive Evaluation of Semiconductor Materials and Devices pp 677–738Cite as

Non-Destructive Tests Used to Insure the Integrity of Semiconductor Devices with Emphasis on Passive Acoustic Techniques

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Part of the book series: NATO Advanced Study Institutes Series ((NSSB,volume 46))

Abstract

This paper reviews a number of important non-destructive tests used frequently in the semiconductor industry to test the mechanical integrity of semiconductor devices. Many of these tests are not rigorously quantitative, but rather, involve an element of human judgement or some empirical comparison for interpretation. As such, the usage of some of the tests is controversial even though they are specified in important military and other microelectronic standards. The scientist or engineer just entering the microelectronics field should look upon this as an opportunity to develop better tests rather than be discouraged by the lack of rigor.

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Author information

Authors and Affiliations

  1. Electron Devices Division, National Bureau of Standards, Washington, DC, 20234, USA

    George G. Harman

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  1. George G. Harman
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Editor information

Editors and Affiliations

  1. The University of Pennsylvania, Philadelphia, Pennsylvania, USA

    Jay N. Zemel

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© 1979 Springer Science+Business Media New York

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Harman, G.G. (1979). Non-Destructive Tests Used to Insure the Integrity of Semiconductor Devices with Emphasis on Passive Acoustic Techniques. In: Zemel, J.N. (eds) Nondestructive Evaluation of Semiconductor Materials and Devices. NATO Advanced Study Institutes Series, vol 46. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-1352-7_13

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  • DOI: https://doi.org/10.1007/978-1-4757-1352-7_13

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-1354-1

  • Online ISBN: 978-1-4757-1352-7

  • eBook Packages: Springer Book Archive

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