Non-Destructive Tests Used to Insure the Integrity of Semiconductor Devices with Emphasis on Passive Acoustic Techniques

  • George G. Harman
Part of the NATO Advanced Study Institutes Series book series (NSSB, volume 46)


This paper reviews a number of important non-destructive tests used frequently in the semiconductor industry to test the mechanical integrity of semiconductor devices. Many of these tests are not rigorously quantitative, but rather, involve an element of human judgement or some empirical comparison for interpretation. As such, the usage of some of the tests is controversial even though they are specified in important military and other microelectronic standards. The scientist or engineer just entering the microelectronics field should look upon this as an opportunity to develop better tests rather than be discouraged by the lack of rigor.


Acoustic Emission Nondestructive Test Acoustic Emission Signal Solder Bump Scanning Electron Microscope Photograph 
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Copyright information

© Springer Science+Business Media New York 1979

Authors and Affiliations

  • George G. Harman
    • 1
  1. 1.Electron Devices DivisionNational Bureau of StandardsUSA

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