A fully integrated 8 × 8 element acoustic array module has been fabricated and its electro-acoustic performance measured. The matrix of 2 × 2 mm hydrophones is sawcut into a 3 MHz fundamental resonance frequency Y-cut LiNbO3 wafer. Dual-gate deep depletion mode IGFET’s are used with each element of the array for addressing and amplification. This integrated circuitry is contained on a single silicon on sapphire wafer and is bonded to the piezoelectric material in one processing operation. Addressing terminals are available along one edge of the array with signal outputs along another edge.
At 1 MHz in a water medium, the sensitivity was measured to be -115 dBV/micro Pascal and the minimum detectable acoustical intensity was measured to be 27 nano watt/cm2. The dual gate cascode amplifier provides 15 dB of voltage gain with a 15k ohm load resistor and has a feedback capacitance of 0.05 of, which provides flat frequency response to 5 MHz.
KeywordsPiezoelectric Material Lithium Niobate Piezoelectric Element Large Scale Integrate High Frequency Response
Unable to display preview. Download preview PDF.
- 6.P.Alais “Acoustical Imaging by Electrostatic Transducers” in Acoustical Holography, Vol. 4, G. Wade, Edl, 1972, pp. 237–249.Google Scholar
- 7.W.R.Fenner and G.E. Stewart, An Ultrasonic Holographic Imaging System for Medical Applications“ in Acoustical Holography, Vol. 5, P.S. Green, Ed., Plenum Press, N.Y., 1974, pp. 493–503.Google Scholar
- 9.J.E. Jacobs, “Ultrasound Image Converter Systems Utilizing Electron-Scanning Techniques’, IEEE Trans., Sonics and Ultrasonics, SU-15, pp. 146–152 (1968).Google Scholar
- 10.G.L. Sackman and R.J. Larkin, “An Electronically Scanned Transducer Array Using Micro Circuit Devices” in Acoustical Holography, Vol. 3, A.F. Metherell, Ed., Plenum Press, N.Y;, 1971, DD. 21_1–223.Google Scholar
- 11.N.0. ‘Booth and J.L. Sutton,,“Holographic Acoustic Imaging” Naval Undersea Center, San Diego, CA, NUC-TP 424.Google Scholar
- 12.E. Marom, R.K. Mueller, R.F. Koopelmann, G.Z.Zilinskas, “Design and Preliminar,y Test of an Underwater Viewing System Using Sound Holography”;in Acoustical Holography, Vol. 3, A.F. Metherell, Ed., Plenum Press,;1971,;op. 191–209Google Scholar
- M.G. Maginness,.J.J. Plummer, and J.D. Meindl, “An Acoustic Image Sensor Using a Transmit-Receiver Array” in Acoustical Holography, Vol. 5, P.S. Green, Ed., 1974, pp. 619–631.Google Scholar
- 14.D.H.R. Vilkomerson, “Analysis of Various Ultrasonic Holographic Imaging Methods for Medical Diagnosis”, Acoustical Holography, Vol. 4., G,’4ade, ED., 1972, op. 401–429Google Scholar
- 15.J,E. McCormick “On the Reliability of Microconnections” Electronic Packaging and Production, pp. 167–168, June 1968.Google Scholar
- 16.R.S. Muller and J. Conragan, “Transducer Action in a MetalInsulator-Plezoelectric-Semiconductor Triode”. Appl. Phys, Lett., 20, pp. 156–158_’(1972).Google Scholar
- 17.E.W. Greeneich and R.S. Muller, “Acoustic-Wave Detection via a Piezoelectric Field-Effect Transducer”, Appì. Phys. Lett., 20, pp. 156.153, (1972)Google Scholar
- 18.J.K. Liu, R.B. Stokes and K.M. Lakin, “Evaluation of AIN Films on Sapphire for Surface Acoustic Wave Applications”, Proc.-IEEE, 1975 Ultrasonics Symposium, 75 CHO 994–450 IEEE, N.Y., pp. 234–237 (1975)Google Scholar
- 19.T.F. Reuter and R.H. Bolt, Sonics Wiley, N.Y., Ch. 4, 1955.Google Scholar
- 20.J.S.T. Huang, “Characteristics of a Depletion-Type IGFET”, IEEE Trans., ED-20, pn. 513–514 (1973).Google Scholar
- 21.R.S. Ronen and L. Strauss, “The Silicon on Sapphire DOS Tetrode Source Small Signai Features, LF-to-UHF”, IEEE Trans. on Electron Devices ED-21, 100–109, (1974).Google Scholar
- 22.R.S. Muller and J. Conragan, “A Metal-Insulator-Piezoelectric Semiconductor Electromechanical Transducer”, IEEE Trans. on Elect. Dev. ED-12, pp. 590’-595,. (1965).Google Scholar