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Bonding Plastic to Metal for High Strength at Low Temperatures

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Advances in Cryogenic Engineering

Part of the book series: Advances in Cryogenic Engineering ((ACRE,volume 4))

Abstract

In using the technique of overlaying a metal componen with some other material in order to capitalize on certain surface properties (e.g., low frictional coefficient) possessed by the material, but lacking in the metal, one of the major problems to be encountered is that of satisfactory attachment. Research in the field of adhesive bonding has provided considerable knowledge and many products which are usable at elevated temperatures, but very little data exist concerning bonds operating at temperatures much below -65° F. In particular, the satisfactory attachment of a Teflon facing to a metal part for cryogenic application introduces several unique problems, arising primarily from the extraordinary properties possessed by Teflon. These include a thermo-expansivity 10 to 15 times that of most metals, complete chemical inertness to all but a few substances, and the ability of the surface to resist sticking to nearly all normally adhesive materials.

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© 1960 Springer Science+Business Media New York

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Eppinger, C.E., Love, W.J. (1960). Bonding Plastic to Metal for High Strength at Low Temperatures. In: Timmerhaus, K.D. (eds) Advances in Cryogenic Engineering. Advances in Cryogenic Engineering, vol 4. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-0540-9_10

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  • DOI: https://doi.org/10.1007/978-1-4757-0540-9_10

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-0542-3

  • Online ISBN: 978-1-4757-0540-9

  • eBook Packages: Springer Book Archive

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