Abstract
The possibility of using superconducting switches (cryotrons) to build electronic computing circuits has been under study in several industrial laboratories for a number of years. The majority of the work to date has been directed toward developing the technology required to fabricate the thin-film type of cryotron required for the construction of high-speed integrated electronic circuits. At the present time, this technology has advanced to the point where it is possible to contemplate the development of some fairly large modules. Concurrently, it has become increasingly evident that the circuit operating speeds, which are limited primarily by the difficulties of transferring heat from the active cryotron elements to the refrigerator heat sink, will be considerably less than can be obtained with semiconductor components. This being the case, the principal motivations for developing the cryogenic technology must stem from the economic advantages to be gained in the batch fabrication of a large number of interconnected components, In this connection, the costs as well as the technical problems of refrigeration are found to play significant roles.
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References
D. A. Buck, Proc. IRE, Vol. 44, 482 (1956).
V. L. Newhouse and J. W. Bremer, J. Appl. Phys., Vol. 30, 1458 (1959).
W. B. Ittner, III, The Solid State J., July/August, 1960.
M. D. Reeber, IBM Research, private communication.
W. E. Pennebaker, IBM Research, private communication.
L. L. Burns, Jr., G. A. Alphonse, and G. W. Leck, Trans. IRE, Vol. EC-10, 438 (1961).
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Ittner, W.B. (1963). Cryogenic Electronics. In: Timmerhaus, K.D. (eds) Advances in Cryogenic Engineering. Advances in Cryogenic Engineering, vol 8. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-0528-7_4
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DOI: https://doi.org/10.1007/978-1-4757-0528-7_4
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