Abstract
The grain boundary transport of aluminum chromium, and copper resulting from electromigration at 175°C in aluminum-chromium and aluminum-copper thin film conductors has been measured. The forces acting on the various types of atoms are estimated from other experiments or from theoretical derivations. It is then possible to calculate the diffusion constants of the different atomic species. The values obtained for aluminum grain boundary diffusion in aluminum-chromium correspond well to values which have been found through different means in the grain boundary of pure silver. It is concluded that chromium does not reduce the rate of grain boundary diffusion of aluminum, but copper reduces this rate by a factor of about 80. The results of a series of electromigration experiments in aluminum-copper thin films are interpreted in terms of the information they yield on the diffusion of adsorbed copper atoms in aluminum-copper grain boundaries. The conclusions reached are compared to the previously reported results on the effect of alloy additions on grain boundary diffusion in a variety of different elements.
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References
W. Jost,‘Diffusion in Solids, Liquids and Gases’, Academic Press, New York, (1952), p. 324.
J. Verhoeven, Metal, Reviews, 8, 311–368 (1963).
H. B. Huntington, TMS-AIME, 245, 2571–2579 (1969).
Y. Adda and J. Philibert, ‘La Diffusion dans les Solides’, Presses Universitaires, Paris (1966), p. 893.
F. M. d’Heurle, Proc. IEEE, 59, 1409–1418 (1971).
M. A. Dayananda, Met. Trans., 2, 334–335 (1971).
M. Gerl, Z. Naturforsch, 26a, 1–9 (1971).
S. G. Epstein, Adv. Phys., 16, 325–332 (1960).
J. R. Wilson, R.G.R. Sellors and J.N. Pratt, Adv. Phys., 16, 357 (1960).
D. O. Olson, J. L. Blough and D. A. Rigney, Conference Abstracts, Joint AIME and ASM Fall Meeting, Detroit, (Oct., 1971), p. 1571.
J. C. Blair, P. B. Ghate and T. C. Haywood, Appl. Phys. Letters, 17, 281–283 (1970).
R. E. Hummel and H. M. Breitling, Z. Naturforsch, 26a, 36–39 (1971).
P. S. Ho and L. D. Glowinski, Z. Natur forsch, 26a, 32–35 (1971).
L. Berenbaum, J. Appl. Phys., 42:, 880–882 (1971).
J. K. Howard and R. Ross, J. Appl. Phys., 42, 2996–2998 (1971).
A. Gonzales and E. M. Philofsky, Proc. IEEE, 59, 1429–1433 (1971).
R. E. Hummel and H. M. Breitling, Appl. Phys. Letters, 18, 373–375 (1971).
P. Adam, Z. Naturforsch, 26a, 40–44 (1971).
M. Ohring, J. Appl. Phys., 42, 2653–2661 (1971).
M. Ohring, Mat. Sci. and Eng., 7, 158–167 (1971).
R. Rosenberg and M. Ohring, J. Appl. Phys., to be published.
R. Rosenberg, J. Vac. Sci. Technology, 9, Jan/Feb (1972).
M. Ohring and P. H. Sun, J. Vac. Sci. Technology, 9, Jan/Feb (1972).
M. Ohring and P. H. Sun, Thin Solid Films, to be published.
D. L. Kennedy, J. Appl. Phys., 39, 6102–6104 (1968).
I. Ames, F. M. d’Heurle and R. E. Horstmann, IBM J. Res. Develop., 14, 461–463 (1970).
F. M. d’Heurle, Met. Trans., 2, 681–689 (1971).
L. Berenbaum and B. Patnaik, Appl. Phys. Letters, 18, 284–286 (1971).
L. Berenbaum and R. Rosenberg, IEEE Proc. 9th Reliability Physics Symposium, Las Vegas (1971), pp. 136–141.
J. K. Howard and R. Ross, J. Appl. Phys., 42, 2996–2998 (1971).
E. Hall, E. Philofsky and A. Gonzales, J. Electronic Mat., to be published.
M. C. Shine and F. M. d’Heurle, IBM J. Res. Dev., 15, 378–383 (1971).
B. N. Agarwala, B. Patnaik and R. Schwitzel, J. Vac. Sci Technology, 9, Jan/Feb (1972).
F. M. d’Heurle, N. G. Ainslie, A. Gangulee and M. C. Shine, J. Vac. Sci. Technology, 9, Jan/Feb (1972).
A. Gangulee and F. M. d’Heurle, Appl. Phys. Letters, 19, 76–77 (1971).
H. B. Huntington and A. R. Grone, J. Phys. Chem. Solids, 23, 76–87 (1961).
C. Bosvieux and J. Friedel, J. Phys. Chem. Solids, 23, 123–126 (1962).
F. M. d’Heurle, L. Berenbaum and R. Rosenberg, TMS-AIME, 242, 502–511 (1968).
I. Ames, J. Hoekstra and G. Folchi, Rev. Scient. Instrum., 42, 1049–1051 (1971).
T. Federighi, ‘Lattice Defects in Quenched Metals’, R. Cotterill, M. Doyama, J. Jackson and M. Meshii, Eds, Academic Press, New York (1965), pp. 217–268.
H. K. Hardy, J. Inst. Met., 80, 483–492 (1951–52).
R. V. Penny, J. Phys. Chem. Solids, 25, 335–345 (1964).
R. Rosenberg and L. Berenbaum, Appl. Phys. Letters, 12, 201–204 (1968).
I. A. Blech and E. S. Meieran, J. Appl. Phys., 40, 485–491 (1969).
M. J. Attardo and R. Rosenberg, J. Appl. Phys., 41, 2381–2386 (1970).
V. N. Kaygorogdov, S. M. Klotsman, A. N. Timofeyev and I. S. Trakhtenberg, Fiz. Met. Metalloved 25, 910–923 (1968).
D. Turnbull and R. E. Hoffman, Acta Met., 2, 419–426 (1954).
R. Rosenberg, Appl. Phys. Letters, 16, 27–29 (1970).
K. T. Aust and J. W. Rutter, TMS-AIME, 215, 119–127 (1959).
K. T. Aust and J. W. Rutter, TMS-AIME, 215, 820–830 (1959).
D. McLean, ‘Grain Boundaries in Metals’,Oxford U. Press, London (1957), p.125.
D. R. Beaman, R. W. Baluffi and R.O. Simons, Phys. Rev., 134A, 532–542 (1964).
D. R. Beaman, R. W. Baluffi and R. O. Simons, Phys. Rev., 137A, 917–924 (1966).
M. Hansen, ‘Constitution of Binary Alloys,’ McGraw Hill Co., New York (1958), pp. 81–84.
Nguyen Van Doan, J. Phys. Chem. Solids, 31, 2079–2085 (1970).
J. Friedel, Can. J. Phys., 34, 1190–1211 (1956).
P. Gordon and R. A. Vandermeer, TMS-AIME, 224, 917–928 (1962).
N. L. Peterson and S. J. Rothman, Phys. Rev.,B1,(1970).
W. Alexander and L. Silfkin, Phys. Rev., Bl, 3275–3282 (1970).
J. E. Hilliard, B. L. Averbach and M. Cohen, Acta Met., 7, 86–92 (1959).
G. M. Hood, Phil. Mag., 21, 305–328 (1970).
G. P. Tiwari and B. S. Sharma, Phil. Mag., 24, 739–743 (1971).
G. M. Hood and R. J. Schultz, Phil. Mag., 23, (1971).
V. I. Arkharov, K. A. Efremova, S.I. Ivanovskaya, A.K. Sholts and B. A. Yulinov, Doklady Akad. Nauk. SSSR, 89, 269–270 (1953).
P. Guivaldenq and P. Lacombe, ‘Proprietes des Joints de Grains’, 4° Colloque de Metallurgie, Saclay (1960), Presses Universitaires de France, pp. 105–114.
C. Leymonie and P. Lacombe, Mem. Sci. Rev. Met., 57, 285–290 (1960).
S. Z. Bokshtein, ‘Diffusion Processes, Structure and Properties of Metals’, S. Z. Bokshtein Ed., Consultants Bureau, New York (1965) pp. 2–8.
A. Austin and N. Richards, J. Appl. Phys., 33, 3569–3574 (1962).
V. I. Arkharov, S. M. Klotsman and A. N. Timofeyev, Fiz. Met. Metalloved, 6, 255–260 (1958).
V. I. Arkharov and A. A. Pentina, Fiz. Met. Metalloved, 5, 52–56 (1957).
G. Barreau, G. Brunei, G. Cizeron and P. Lacombe, Mem. Sci. Rev. Met., 68, 358–366 (1971).
V. I. Arkharov, S. M. Klotsman and A. N. Timofeyev, Fiz. Met. Metalloved, 8, 709–713 (1959).
S. M. Klotsman, A. N. Timofeyev and I. S. Trakhtenberg, Fiz. Met. Metalloved, 20, 78–83 (1965).
R. E. Hoffman and D. Turnbull, J. Appl. Phys., 22, 634–639 (1951).
W. Schintlmeister and K. Richter, Planseeberichte für Pulvermetallurgie, 18, 3–6 (1970).
V. T. Borisov, V. M. Golikov and G. V. Scherbedinsky, Fiz. Met. Metalloved, 17, 881–885 (1964).
A. M. Huntz, P. Guivaldenq, M. Aucouturier and P. Lacombe, Mem. Sci. Rev. Met., 66, 85–104 (1969).
T. Rosso, M. Aucouturier and P. Lacombe, Scripta Met., 2, 393–398 (1968).
M. Aucouturier, T. Araki. T. Rosso and P. Lacombe, Mem. Sci. Rev. Met., 65, 255–265 (1968).
V. N. Kaygorodov, S. M. Klotsman, A. N. Timofeyev and I. S. Trakhtenberg, Fiz. Met. Metalloved, 27, 1048–1053 (1969).
V. N. Kaygorodov, Y. A. Rabovsky and V. K. Talinsky, Fiz. Met. Metalloved, 24, 117–124 (1967).
V. N. Kaygorodov, S. M. Klotsman, A. N. Timofeyev and I. S. Trakhtenberg, Fiz. Met. Metalloved., 28, 120–128 (1969).
V. N. Kaygorodov, Y. A. Rabovsky and V. K. Talinsky, Fiz. Met. Metalloved, 24, 661–668 (1967).
J. B. Murphy, Acta Met., 9 563–569 (1961).
T. S. Lundy and J. F. Murdock, J. Appl. Phys., 33, 1671–1673 (1958).
M. Beyeler and D. Lazarus, Mem. Sci. Rev. Met., 67, 395–400 (1970).
T. Rosso and C. Sabatini, Scripta Met. 6, 51–54 (1972).
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© 1972 American Institute of Mining, Metallurgical and Petroleum Engineers, Inc.
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d’Heurle, F.M., Gangulee, A. (1972). Solute Effects on Grain Boundary Electromigration and Diffusion. In: Hu, H. (eds) The Nature and Behavior of Grain Boundaries. Springer, New York, NY. https://doi.org/10.1007/978-1-4757-0181-4_14
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DOI: https://doi.org/10.1007/978-1-4757-0181-4_14
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