Abstract
High power rectifiers and thyristors are generally fabricated with float zone silicon material. The resistivity variations of this type of material produce non-uniform electrical characteristics from device to device, especially in blocking voltage, forward voltage drop, and switching characteristics. Large area NTD (neutron transmutation doped) silicon1 has become available from different suppliers since 1975. This type of silicon has a narrow range of resistivity across the whole area. During the last few years, we have evaluated and manufactured 50mm to 67mm diameter high resistivity NTD silicon for high power devices. Devices fabricated from this type of material resulted in a higher voltage distribution and a narrower distribution of electrical characteristics.
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References
M. Tanenbum and A. D. Mills, J. Electrochem Soc., 108, 171, (1961).
C. K. Chu, J. E. Johnson, and W. H. Karstaedt, “The Impact of NTD Silicon on High Power Thyristors and Applications,” IAS Paper, 27-D, 1977.
C. K. Chu, J. Bartko, and P. E. Felice, “Electron Radiated Fast Switch Power Thyristor,” 1975 Annual IAS Meeting Record, 75CH0999–31A, p 180.
C. K. Chu and J. E. Donlon, “Annealing Effects on Electron Irradiated and Gold Diffused Thyristors for Fast Switch Application,” 1976 IEEE-IAS Meeting Record, 76CH1122–1–1A, p 51.
K. Platzoder and K. Loch, IEEE Trans. Electron Devices, ED-23, No. 8, August 1976.
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© 1979 Plenum Press, New York
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Chu, C.K., Johnson, J.E. (1979). NTD Silicon on High Power Devices. In: Meese, J.M. (eds) Neutron Transmutation Doping in Semiconductors. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-8249-2_6
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DOI: https://doi.org/10.1007/978-1-4684-8249-2_6
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4684-8251-5
Online ISBN: 978-1-4684-8249-2
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