Abstract
The use of high-surface-area materials in dilution refrigerators has prompted several studies of the thermal resistance between such materials and dilute or concentrated 3He in 4He. Roubeau et al.t first reported anomalously high values for the Kapitza resistance of 20-μm-thick copper foil as compared with the Kapitza resistance of bulk copper. They proposed that this was a result of a thermal resistance between phonons and electrons. Wheatley et al.2 also saw this higher resistance when using 32-μm copper foil. We looked for this effect in sintered copper powders of 27, 20, and 2 μm diameter and also found high resistances.3 Our results were in semiquantitative agreement with Seiden’s calculations’ on the phonon-electron resistance.
Contribution of the National Bureau of Standards, not subject to copyright. t Performed by P. D. Coulter of Union Carbide Corp., Cleveland, Ohio
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References
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Radebaugh, R., Siegwarth, J.D. (1974). Heat Transfer between Fine Copper Powders and Dilute 3He in Superfluid 4He. In: Timmerhaus, K.D., O’Sullivan, W.J., Hammel, E.F. (eds) Low Temperature Physics-LT 13. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-7864-8_82
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DOI: https://doi.org/10.1007/978-1-4684-7864-8_82
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