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Recent Advances in Microfabrication

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Electronic Properties of Multilayers and Low-Dimensional Semiconductor Structures

Part of the book series: NATO ASI Series ((NSSB,volume 231))

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Abstract

This paper discusses various new developments in III–V materials processing and their application to microdevice fabrication. In the field of patterning, the main tools are lift-off and dry etching. Both are scalable down to nanometer dimensions and have been used to produce quantum-size devices. Current control requires both Schottky and ohmic contacts on the device. Progress in processing technology now allows better control of the contact parameters, and the increased flexibility hereby obtained can be considered as a first step towards real “contact engineering”. Finally, flexibility in the use of substrates has also been increased by the development of novel techniques for composite substrates fabrication and for device transplantation from one substrate to another.

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Author information

Authors and Affiliations

  1. IMEC vzw, Kapeldreef 75, 3030, Leuven, Belgium

    M. Van Rossum, M. Van Hove, W. De Raedt, M. De Potterm & P. Jansen

Authors
  1. M. Van Rossum
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  2. M. Van Hove
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  3. W. De Raedt
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  4. M. De Potterm
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  5. P. Jansen
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Editor information

Editors and Affiliations

  1. Nottingham University, Nottingham, UK

    J. M. Chamberlain  & Laurence Eaves  & 

  2. CNRS-INSA, Toulouse, France

    Jean-Claude Portal

  3. CNRS-SNCI, Grenoble, France

    Jean-Claude Portal

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© 1990 Plenum Press, New York

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Van Rossum, M., Van Hove, M., De Raedt, W., De Potterm, M., Jansen, P. (1990). Recent Advances in Microfabrication. In: Chamberlain, J.M., Eaves, L., Portal, JC. (eds) Electronic Properties of Multilayers and Low-Dimensional Semiconductor Structures. NATO ASI Series, vol 231. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-7412-1_13

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  • DOI: https://doi.org/10.1007/978-1-4684-7412-1_13

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4684-7414-5

  • Online ISBN: 978-1-4684-7412-1

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