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Stability Studies of the Chlorine Containing Phase at the SiO2/Si Interface Produced by HCl/O2 Oxidation of Silicon

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Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems

Part of the book series: Materials Science Research ((MSR,volume 14))

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Abstract

SiO2/Si samples prepared in 2% and 4% hcl/O2 mixtures at 1200°C have been annealed in H2O/N2 ambients at 1200°C. The anneals ranged up to 16 hrs in ambients with 4 or 40 ppm H2O in N2. Rutherford backscattering measurements have been made to determine the amount and location of C1 incorporated in these samples. A linear loss of C1 with annealing time is found for all samples. Changes in the distribution of C1 near the SiO2/Si interface are found. These changes are interpreted in terms of morphological changes in the third (Cl containing)phase. A significant effect of the H2O content of the N2 ambient is observed.

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References

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Author information

Authors and Affiliations

  1. Sherman Fairchild Laboratory, Lehigh University, Bethlehem, PA, 18015, USA

    S. R. Butler, F. J. Feigl, S. L. Titcomb & H. Tsai

  2. Brookhaven National Laboratory, Upton, Long Island, NY, USA

    K. H. Jones & H. W. Kraner

Authors
  1. S. R. Butler
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  2. F. J. Feigl
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  3. S. L. Titcomb
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  4. H. Tsai
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  5. K. H. Jones
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  6. H. W. Kraner
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Editor information

Editors and Affiliations

  1. The Lawrence Berkeley Laboratory, University of California, Berkeley, California, USA

    Joseph Pask  & Anthony Evans  & 

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© 1981 Plenum Press, New York

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Butler, S.R., Feigl, F.J., Titcomb, S.L., Tsai, H., Jones, K.H., Kraner, H.W. (1981). Stability Studies of the Chlorine Containing Phase at the SiO2/Si Interface Produced by HCl/O2 Oxidation of Silicon. In: Pask, J., Evans, A. (eds) Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems. Materials Science Research, vol 14. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-3947-2_32

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  • DOI: https://doi.org/10.1007/978-1-4684-3947-2_32

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4684-3949-6

  • Online ISBN: 978-1-4684-3947-2

  • eBook Packages: Springer Book Archive

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