Abstract
The creep of ceramic materials at elevated temperatures may take place by the movement of dislocations within the lattice, by grain boundary sliding, and/or by stress-directed diffusion either through the lattice or along the grain boundaries. Other accommodation mechanisms, such as grain boundary separations, may also occur. Some indication of the significant creep mechanism may be obtained by determining the dependence of steady-state creep rate on stress, grain size, and temperature. A comparison is made between the predictions arising from the theoretical models and recent experimental data obtained on several materials in both single crystal and polycrystalline forms.
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Langdon, T.G., Cropper, D.R., Pask, J.A. (1971). Creep Mechanisms in Ceramic Materials at Elevated Temperatures. In: Kriegel, W.W., Palmour, H. (eds) Ceramics in Severe Environments. Materials Science Research, vol 5. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-3141-4_20
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DOI: https://doi.org/10.1007/978-1-4684-3141-4_20
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